B
鍙冩暩(sh霉)璩囨枡
鍨嬭櫉(h脿o)锛� MC14536BFELG
寤犲晢锛� ON Semiconductor
鏂囦欢闋�(y猫)鏁�(sh霉)锛� 6/14闋�(y猫)
鏂囦欢澶�?銆�?/td> 0K
鎻忚堪锛� IC OSC PROG TIMER 2MHZ 16SOEIAJ
妯�(bi膩o)婧�(zh菙n)鍖呰锛� 2,000
椤�(l猫i)鍨嬶細 鍙法绋嬭▓(j矛)鏅�(sh铆)鍣�
闋荤巼锛� 2MHz
闆绘簮闆诲锛� 3 V ~ 18 V
闆绘祦 - 闆绘簮锛� 15µA
宸ヤ綔婧害锛� -55°C ~ 125°C
灏佽/澶栨锛� 16-SOIC锛�0.209"锛�5.30mm 瀵級
鍖呰锛� 甯跺嵎 (TR)
渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 16-SOEIAJ
瀹夎椤�(l猫i)鍨嬶細 琛ㄩ潰璨艰
MC14536B
http://onsemi.com
14
PACKAGE DIMENSIONS
SOIC16 WB
CASE 751G03
ISSUE D
D
14X
B
16X
SEATING
PLANE
S
A
M
0.25
B S
T
16
9
8
1
h
X
45
_
M
B
M
0.25
H
8X
E
B
A
e
T
A1
A
L
C
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM MIN
MAX
MILLIMETERS
A
2.35
2.65
A1
0.10
0.25
B
0.35
0.49
C
0.23
0.32
D 10.15 10.45
E
7.40
7.60
e
1.27 BSC
H 10.05 10.55
h
0.25
0.75
L
0.50
0.90
q
0
7
_
11.00
16X
0.58
16X
1.62
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
ON Semiconductor and
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