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參數(shù)資料
| 型號(hào)： | MC144110DWR2 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 3/12頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC HEX SERIAL D/A CONV 20-SOIC |
| 標(biāo)準(zhǔn)包裝： | 1,000 |
| 位數(shù)： | 6 |
| 數(shù)據(jù)接口： | 串行 |
| 轉(zhuǎn)換器數(shù)目： | 6 |
| 電壓電源： | 雙 ± |
| 功率耗散（最大）： | 30mW |
| 工作溫度： | 0°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 20-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 20-SOIC |
| 包裝： | 帶卷 (TR) |
| 輸出數(shù)目和類型： | 12 電壓，單極 |
| 采樣率（每秒）： | * |
| 其它名稱： | MC144110DWTR |
Packaging
MC144110 Technical Data, Rev. 2
Freescale Semiconductor
11
Figure 9. Outline Dimensions for P SUFFIX, PLASTIC DIP
(CASE 646-07, Issue P)
Figure 10. Outline Dimensions for DW SUFFIX, SOG
(CASE 751G-04, Issue D)
17
14
8
B
A
DIM
MIN
MAX
INCHES
A
0.715
0.770
B
0.240
0.260
C
0.145
0.185
D
0.015
0.021
F
0.040
0.070
G
0.100 BSC
H
0.052
0.095
J
0.008
0.015
K
0.115
0.135
L
M
---
10
N
0.015
0.040
0.290
0.310
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
6. 646-06 OBSOLETE, NEW STANDARD 646-07.
F
HG
D 14 PL
K
C
SEATING
PLANE
N
-T-
M
(0.005)
L
M
J
NOTES:
1.
2.
3.
4.
5.
6.
DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
DATUMS A AND B TO BE DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURRS. MOLD
FLASH, PROTRUSION OR GATE BURRS SHALL
NOT EXCEED 0.15mm PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE
INTER-LEAD FLASH OR PROTRUSIONS.
INTER-LEAD FLASH AND PROTRUSIONS
SHALL NOT EXCEED 0.25mm PER SIDE. THIS
DIMENSION IS DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL NOT CAUSE
THE LEAD WIDTH TO EXCEED 0.62mm.
SEATING
PLANE
0.49
16X
B
M
0.25
A
T
0.35
2.65
2.35
0.25
0.10
6
T
16X
0.1 T
1.27
14X
8
9
1
16
8X
10.55
10.05
M
0.25
B
4
10.45
10.15
A
7.6
7.4
B
PIN 1 INDEX
PIN'S
NUMBER
5
A
0.75
X45
0.25
7
1.0
0.4
0
0.32
0.23
SECTION A-A
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| MC144111DW | 功能描述:IC QUAD SERIAL D/A CONV 16-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時(shí)間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
| MC144111DWR2 | 功能描述:IC QUAD SERIAL D/A CONV 16-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時(shí)間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
| MC144111P | 制造商:Motorola Inc 功能描述: |
| MC14411L | 制造商: 功能描述: 制造商:undefined 功能描述: |
| MC14411P | 制造商:Motorola 功能描述:MOTOROLA |
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