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| 型號(hào)： | MC14073BFR1 |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類(lèi)： | 門(mén)電路 |
| 英文描述： | 4000/14000/40000 SERIES, TRIPLE 3-INPUT AND GATE, PDSO14 |
| 封裝： | EIAJ, PLASTIC, SOIC-14 |
| 文件頁(yè)數(shù)： | 2/21頁(yè) |
| 文件大小： | 255K |
| 代理商： | MC14073BFR1 |
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MC14001B Series
http://onsemi.com
10
PACKAGE DIMENSIONS
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 965–01
ISSUE O
HE
A1
DIM
MIN
MAX
MIN
MAX
INCHES
---
2.05
---
0.081
MILLIMETERS
0.05
0.20
0.002
0.008
0.35
0.50
0.014
0.020
0.18
0.27
0.007
0.011
9.90
10.50
0.390
0.413
5.10
5.45
0.201
0.215
1.27 BSC
0.050 BSC
7.40
8.20
0.291
0.323
0.50
0.85
0.020
0.033
1.10
1.50
0.043
0.059
0
0.70
0.90
0.028
0.035
---
1.42
---
0.056
A1
HE
Q1
LE
_ 10_
0
_ 10_
LE
Q1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.13 (0.005) M
0.10 (0.004)
D
Z
E
1
14
8
7
e
A
b
VIEW P
c
L
DETAIL P
M
A
b
c
D
E
e
0.50
M
Z
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