參數(shù)資料
型號: MC10SX1130DG
廠商: ON SEMICONDUCTOR
元件分類: 顯示驅(qū)動器
英文描述: LED Driver
中文描述: LED DISPLAY DRIVER, PDSO16
封裝: LEAD FREE, SOIC-16
文件頁數(shù): 8/9頁
文件大?。?/td> 156K
代理商: MC10SX1130DG
MC10SX1130
http://onsemi.com
8
Now to calculate the dissipated power on the chip for a
nominal application.
V
CC
= 5 V
V
F
= 1.5 V
V
SET
= 0.7 V
I
MOD
= 60 mA
I
CC
= 18 mA
so:
Pd = 5 * 18 + (5 - 1.5 - 0.7) * 60
Pd = 258 mW
This number can be entered into Equation 3 along with the
environmental information to calculate the nominal
operating junction temperature.
Because of the open loop feedback control in the bias
control circuitry, the revised I
MOD
value must be determined
given the tracking rate chosen so that the power dissipation
can be re-calculated. For assessing product reliability, worst
case values should be entered to calculate the maximum
junction temperature.
Reliability of Plastic Packages
Although today’s plastic packages are as reliable as
ceramic packages under most environmental conditions, as
the junction temperature increases a failure mode unique to
plastic packages becomes a significant factor in the long
term reliability of the device.
Modern plastic package assembly utilizes gold wire
bonded to aluminum bonding pads throughout the
electronics industry. As the temperature of the silicon
(junction
temperature)
increases,
compound forms between the gold and aluminum interface.
This intermetallic formation results in a significant increase
in the impedance of the wire bond and can lead to
an
intermetallic
performance failure of the affected pin. With this
relationship between intermetallic formation and junction
temperature established, it is incumbent on the designer to
ensure that the junction temperature for which a device will
operate is consistent with the long term reliability goals of
the system.
Reliability studies were performed at elevated ambient
temperatures (125
°
C) from which an Arrhenius Equation,
relating junction temperature to bond failure, was
established. The application of this equation yields the table
of Table 6. This table relates the junction temperature of a
device in a plastic package to the continuous operating time
before 0.1% bond failure (1 failure per 1000 bonds)
The MC10SX1130 device is designed with chip power
levels that permit acceptable reliability levels, in most
systems, under the conventional 500 lfpm (2.5 m/s) airflow.
T = 6.376
×
10
9
e
11554.267
273.15 + T
J
Where:
Table 6. T
J
vs Time to 0.1% Bond Failure
Junction
Temp. (
°
C)
Time (Hrs.)
Time (yrs.)
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.1
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
ORDERING INFORMATION
Device
Package
Shipping
MC10SX1130D
SOIC
16
48 Units / Rail
MC10SX1130DG
SOIC
16
(Pb
Free)
48 Units / Rail
MC10SX1130DR2
SOIC
16
2500 / Tape & Reel
MC10SX1130DR2G
SOIC
16
(Pb
Free)
2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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