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參數(shù)資料
| 型號： | MC10H351PG |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 電平轉(zhuǎn)換 |
| 英文描述： | BBG ECL TRNSLATR QUAD; Package: 20 LEAD PDIP; No of Pins: 20; Container: Rail; Qty per Container: 18 |
| 中文描述： | QUAD TTL/NMOS TO ECL TRANSLATOR, COMPLEMENTARY OUTPUT, PDIP20 |
| 封裝： | LEAD FREE, PLASTIC, DIP-20 |
| 文件頁數(shù)： | 6/7頁 |
| 文件大?。?/td> | 153K |
| 代理商： | MC10H351PG |
MC10H351
http://onsemi.com
6
PACKAGE DIMENSIONS
SOEIAJ20
CASE 96701
ISSUE A
DIM
MIN
MAX
MIN
MAX
INCHES
2.05
0.081
MILLIMETERS
0.05
0.20
0.002
0.008
0.35
0.50
0.014
0.020
0.15
0.25
0.006
0.010
12.35
12.80
0.486
0.504
5.10
5.45
0.201
0.215
1.27 BSC
0.050 BSC
7.40
8.20
0.291
0.323
0.50
0.85
0.020
0.033
1.10
1.50
0.043
0.059
0
0.70
0.90
0.028
0.035
0.81
0.032
A1
HE
Q1
LE
_ 10_
0
_ 10_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
HE
A1
LE
Q1
_
c
A
Z
D
E
20
110
11
b
M
0.13 (0.005)
e
0.10 (0.004)
VIEW P
DETAIL P
M
L
A
b
c
D
E
e
L
M
Z
CDIP20
L SUFFIX
CERAMIC DIP PACKAGE
CASE 73203
ISSUE E
NOTES:
1. LEADS WITHIN 0.010 DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
DIM
MIN
MAX
INCHES
A
0.940
0.990
B
0.260
0.295
C
0.150
0.200
D
0.015
0.022
F
0.055
0.065
G
0.100 BSC
H
0.020
0.050
J
0.008
0.012
K
0.125
0.160
L
0.300 BSC
M
0
15
N
0.010
0.040
__
A
20
110
11
B
F
C
SEATING
PLANE
D
H
G
K
N
J
M
L
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|---|---|
| MC10H352FN | 功能描述:轉(zhuǎn)換 - 電壓電平 Quad CMOS to PECL RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| MC10H352FNG | 功能描述:轉(zhuǎn)換 - 電壓電平 Quad CMOS to PECL RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| MC10H352FNR2 | 功能描述:轉(zhuǎn)換 - 電壓電平 Quad CMOS to PECL RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| MC10H352FNR2G | 功能描述:轉(zhuǎn)換 - 電壓電平 Quad CMOS to PECL RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| MC10H352P | 功能描述:轉(zhuǎn)換 - 電壓電平 Quad CMOS to PECL RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
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