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參數(shù)資料
| 型號： | MC10H350FNR2 |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 通用總線功能 |
| 英文描述： | PECL* to TTL Translator (+5 Vdc Power Supply Only) |
| 中文描述： | QUAD PECL TO TTL TRANSLATOR, TRUE OUTPUT, PQCC20 |
| 封裝： | PLASTIC, LCC-20 |
| 文件頁數(shù)： | 6/7頁 |
| 文件大?。?/td> | 161K |
| 代理商： | MC10H350FNR2 |
MC10H350
http://onsemi.com
6
PACKAGE DIMENSIONS
SOEIAJ
16
CASE 966
01
ISSUE A
H
E
A
1
DIM
A
MIN
0.05
0.35
0.10
9.90
5.10
1.27 BSC
7.40
0.50
1.10
0
0.70
MAX
2.05
0.20
0.50
0.20
10.50
5.45
MIN
0.002
0.014
0.007
0.390
0.201
0.050 BSC
0.291
0.020
0.043
0
MAX
0.081
0.008
0.020
0.011
0.413
0.215
INCHES
MILLIMETERS
8.20
0.85
1.50
10
0.323
0.033
0.059
10
0.90
0.78
0.028
0.035
0.031
A
1
b
c
D
E
e
H
E
L
Q
1
Z
L
E
M
L
E
Q
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005)
0.10 (0.004)
1
16
9
8
D
Z
E
CDIP
16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A
01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5
THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 62010.
F
E
N
K
C
SEATING
PLANE
A
M
0.25 (0.010)
T
M
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
MIN
0.750
0.240
0.015
0.050 BSC
0.055
0.100 BSC
0.008
0.125
0.300 BSC
0
0.020
MAX
0.785
0.295
0.200
0.020
MIN
19.05
6.10
0.39
MAX
19.93
7.49
5.08
0.50
MILLIMETERS
INCHES
1.27 BSC
1.40
2.54 BSC
0.21
3.18
7.62 BSC
0
0.51
0.065
1.65
0.015
0.170
0.38
4.31
15
15
1.01
0.040
A
B
A
B
16
1
9
8
G
16X
D
B
M
0.25 (0.010)
T
T
16X
J
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| MC10H350M | PECL* to TTL Translator (+5 Vdc Power Supply Only) |
| MC10H350MEL | PECL* to TTL Translator (+5 Vdc Power Supply Only) |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MC10H350FNR2G | 功能描述:轉(zhuǎn)換 - 電壓電平 PECL to TTL RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MLF-8 |
| MC10H350L | 功能描述:轉(zhuǎn)換 - 電壓電平 PECL to TTL RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MLF-8 |
| MC10H350M | 功能描述:轉(zhuǎn)換 - 電壓電平 PECL to TTL RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MLF-8 |
| MC10H350MEL | 功能描述:轉(zhuǎn)換 - 電壓電平 PECL to TTL RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MLF-8 |
| MC10H350MELG | 功能描述:轉(zhuǎn)換 - 電壓電平 PECL to TTL RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MLF-8 |
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