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參數(shù)資料
| 型號(hào)： | MC100LVEP111FAR2G |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 時(shí)鐘及定時(shí) |
| 英文描述： | 100LVE SERIES, LOW SKEW CLOCK DRIVER, 10 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PQFP32 |
| 封裝： | LEAD FREE, LQFP-32 |
| 文件頁(yè)數(shù)： | 10/10頁(yè) |
| 文件大?。?/td> | 173K |
| 代理商： | MC100LVEP111FAR2G |
MC100LVEP111
http://onsemi.com
9
PACKAGE DIMENSIONS
DETAIL Y
A
S1
V
B
1
8
9
17
25
32
AE
P
DETAIL Y
BASE
N
J
D
F
METAL
SECTION AEAE
G
SEATING
PLANE
R
Q
_
W
K
X
0.250
(0.010)
GAUGE
PLANE
E
C
H
DETAIL AD
A1
B1
V1
4X
S
4X
9
T
Z
U
TU
0.20 (0.008)
Z
AC
TU
0.20 (0.008)
Z
AB
0.10 (0.004) AC
AC
AB
M
_
8X
T
,
U
,
Z
TU
M
0.20
(0.008)
Z
AC
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT
WITH THE LEAD WHERE THE LEAD
EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS T, U, AND Z TO BE
DETERMINED AT DATUM PLANE AB.
5. DIMENSIONS S AND V TO BE
DETERMINED AT SEATING PLANE AC.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 (0.010) PER SIDE.
DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
7. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
D DIMENSION TO EXCEED 0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY
VARY FROM DEPICTION.
DIM
A
MIN
MAX
MIN
MAX
INCHES
7.000 BSC
0.276 BSC
MILLIMETERS
B
7.000 BSC
0.276 BSC
C
1.400
1.600
0.055
0.063
D
0.300
0.450
0.012
0.018
E
1.350
1.450
0.053
0.057
F
0.300
0.400
0.012
0.016
G
0.800 BSC
0.031 BSC
H
0.050
0.150
0.002
0.006
J
0.090
0.200
0.004
0.008
K
0.450
0.750
0.018
0.030
M
12 REF
N
0.090
0.160
0.004
0.006
P
0.400 BSC
0.016 BSC
Q
1
5
1
5
R
0.150
0.250
0.006
0.010
V
9.000 BSC
0.354 BSC
V1
4.500 BSC
0.177 BSC
__
_
B1
3.500 BSC
0.138 BSC
A1
3.500 BSC
0.138 BSC
S
9.000 BSC
0.354 BSC
S1
4.500 BSC
0.177 BSC
W
0.200 REF
0.008 REF
X
1.000 REF
0.039 REF
32 LEAD LQFP
CASE 873A02
ISSUE C
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