
PAGE . 1
STAD-MAR.14.2006
MBR3020CT~MBR30100CT
FEATURES
Plastic package has Underwriters Laboratory
Flammability Classification 94V-O.
Flame Retardant Epoxy Molding Compound.
Exceeds environmental standards of
MIL-S-19500/228
Low power loss, high efficiency.
Low forwrd voltge, high current capability
High surge capacity.
For use in low voltage,high frequency inverters
free wheeling , and polarlity protection applications.
In compliance with EU RoHS 2002/95/EC directives
.196(5.00)
.054(1.39)
.038(0.96)
.019(0.50)
.419(10.66)
.139(3.55)
MIN
.
.
.
.
.
.
.163(4.16)
.045(1.15)
.025(0.65)MAX
Positive CT
AC
AC
.1(2.54)
.1(2.54)
.387(9.85)
TO-220AB
Unit : inch (mm)
SCHOTTKY BARRIER RECTIFIERS
VOLTAGE
20 to 100 Volts
30.0 Amperes
CURRENT
R
E
T
E
M
A
R
A
P
L
O
B
M
Y
S
T
C
0
2
0
3
R
B
M
T
C
0
3
0
3
R
B
M
T
C
5
3
0
3
R
B
M
T
C
0
4
0
3
R
B
M
T
C
5
4
0
3
R
B
M
T
C
5
4
0
3
R
B
M
T
C
0
5
0
3
R
B
M
T
C
0
6
0
3
R
B
M
T
C
0
8
0
3
R
B
M
T
C
0
0
1
0
3
R
B
M
S
T
U
e
g
a
V
e
s
e
R
k
a
e
P
t
e
c
e
R
m
u
m
i
a
M
V
M
R
R
0
2
0
3
5
3
0
4
5
4
5
4
0
5
0
6
0
8
0
0
1
V
e
g
a
V
S
M
R
m
u
m
i
a
M
V
S
M
R
4
1
1
2
5
2
8
2
5
3
5
3
5
3
2
4
6
5
0
7
V
e
g
a
V
g
n
o
C
D
m
u
m
i
a
M
V
C
D
0
2
0
3
5
3
0
4
5
4
5
4
0
5
0
6
0
8
0
0
1
V
t
h
n
e
d
a
e
e
C
d
w
F
e
g
a
A
m
u
m
0
i
a
=
M
T
C
9
O
C
I
(
F
)
V
A
0
3
A
-
n
)
o
f
h
h
m
e
C
E
n
D
E
s
m
3
o
d
e
e
C
n
o
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g
S
s
o
p
d
i
p
w
F
u
s
k
a
e
a
e
P
w
J
a
d
e
m
I
M
S
F
5
7
2
A
g
e
p
,
5
1
t
e
g
a
V
d
w
F
m
u
m
i
a
M
V
F
5
5
0
7
0
8
V
T
T
t
g
e
C
a
V
e
g
s
e
n
o
R
C
C
D
D
m
d
u
m
i
a
R
M
t
J
5
0
2
1
=
=
O
C
0
e
e
J
O
C
I
R
1
2
0
A
m
e
c
a
e
R
l
m
r
h
T
l
c
R
θ
C
J
5
O
W
/
C
e
g
n
a
R
e
p
m
e
e
g
a
d
n
a
n
o
u
J
g
n
p
O
T
J
T
G
T
S
0
5
1
+
O
T
0
5
O
C
MECHANICAL DATA
Case: TO-220AB Molded plastic
Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
Polarity: As marked.
Standard packaging: Any
Weight: 0.083 ounces, 2.24grams.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
NOTES:
Both Bonding and Chip structure are available.