參數(shù)資料
型號(hào)： MB9BF506NABGL
元件分類(lèi)： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PBGA112
封裝： 10 X 10 MM, 1.45 MM HEIGHT, 0.80 MM PITCH, PLASTIC, FBGA-112
文件頁(yè)數(shù)： 50/108頁(yè)
文件大?。?/td> 1298K
代理商： MB9BF506NABGL
46
FUJITSU SEMICONDUCTOR CONFIDENTIAL
r6.0
MB9B500A Series
·
Observance of Safety Regulations and Standards
Most countries in the world have established standards and regulations regarding safety, protection from
electromagnetic interference, etc. Customers are requested to observe applicable regulations and standards
in the design of products.
·
Fail-Safe Design
Any semiconductor devices have inherently a certain rate of failure. You must protect against injury,
damage or loss from such failures by incorporating safety design measures into your facility and equipment
such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions.
·
Precautions Related to Usage of Devices
FUJITSU SEMICONDUCTOR semiconductor devices are intended for use in standard applications
(computers, office automation and other office equipment, industrial, communications, and measurement
equipment, personal or household devices, etc.).
CAUTION: Customers considering the use of our products in special applications where failure or
abnormal operation may directly affect human lives or cause physical injury or property damage, or where
extremely high levels of reliability are demanded (such as aerospace systems, atomic energy controls, sea
floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult
with sales representatives before such use. The company will not be responsible for damages arising from
such use without prior approval.
2. Precautions for Package Mounting
Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance
during soldering, you should only mount under FUJITSU SEMICONDUCTOR's recommended conditions.
For detailed information about mount conditions, contact your sales representative.
·
Lead Insertion Type
Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct
soldering on the board, or mounting by using a socket.
Direct mounting onto boards normally involves processes for inserting leads into through-holes on the
board and using the flow soldering (wave soldering) method of applying liquid solder. In this case, the
soldering process usually causes leads to be subjected to thermal stress in excess of the absolute ratings for
storage temperature. Mounting processes should conform to FUJITSU SEMICONDUCTOR recommended
mounting conditions.
If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can
lead to contact deterioration after long periods. For this reason it is recommended that the surface treatment
of socket contacts and IC leads be verified before mounting.
·
Surface Mount Type
Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are
more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in
increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges.
You must use appropriate mounting techniques. FUJITSU SEMICONDUCTOR recommends the solder
reflow method, and has established a ranking of mounting conditions for each product. Users are advised to
mount packages in accordance with FUJITSU SEMICONDUCTOR ranking of recommended conditions.
·
Lead-Free Packaging
CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic
soldering, junction strength may be reduced under some conditions of use.
·
Storage of Semiconductor Devices
Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions
will cause absorption of moisture. During mounting, the application of heat to a package that has absorbed
moisture can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent,
do the following:
DS706-00021-1v0-E
相關(guān)PDF資料
PDF描述
MB9BF506NAPMC 32-BIT, FLASH, 80 MHz, RISC MICROCONTROLLER, PQFP100
MBC13900NT1 L BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR
MBC13900T1 L BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR
MBR2060CT-E1 10 A, 60 V, SILICON, RECTIFIER DIODE, TO-220AB
MBT3906DW1T2 200 mA, 40 V, 2 CHANNEL, PNP, Si, SMALL SIGNAL TRANSISTOR
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MB9BF506NABGL-GE1 制造商:FUJITSU 功能描述:MCU 32BIT CORTEX-M3 FM3 112BGA 制造商:FUJITSU 功能描述:MCU, 32BIT, CORTEX-M3, FM3, 112BGA, Controller Family/Series:ARM Cortex-M3, Core
MB9BF506NAPMC-G-JNE1 制造商:FUJITSU 功能描述: 制造商:FUJITSU 功能描述:MCU 32BIT CORTEX-M3 FM3 100LQFP 制造商:FUJITSU 功能描述:MCU, 32BIT, CORTEX-M3, FM3, 100LQFP 制造商:FUJITSU 功能描述:MCU, 32BIT, CORTEX-M3, FM3, 100LQFP, Controller Family/Series:ARM Cortex-M3, Core Size:32bit, No. of I/O's:80, Supply Voltage Min:2.7V, Supply Voltage Max:5.5V, Digital IC Case Style:LQFP, No. of Pins:100, Program Memory Size:512KB, , RoHS Compliant: Yes
MB9BF506NBBGL-GE1 制造商:FUJITSU 功能描述:
MB9BF506NBPMC-G-JNE2 制造商:FUJITSU 功能描述:
MB9BF506NPMC-ESE1 制造商:FUJITSU 功能描述:
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*