- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄45193 > MB91637ABGL (FUJITSU LTD) 32-BIT, MROM, 40 MHz, RISC MICROCONTROLLER, PBGA144 PDF資料下載
參數(shù)資料
| 型號： | MB91637ABGL |
| 廠商： | FUJITSU LTD |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, MROM, 40 MHz, RISC MICROCONTROLLER, PBGA144 |
| 封裝： | 12 X 12 MM, 1.45 MM HEIGT, 0.80 MM PITCH, PLASTIC, PFBGA-144 |
| 文件頁數(shù)： | 76/136頁 |
| 文件大小： | 4123K |
| 代理商： | MB91637ABGL |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁當(dāng)前第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁第115頁第116頁第117頁第118頁第119頁第120頁第121頁第122頁第123頁第124頁第125頁第126頁第127頁第128頁第129頁第130頁第131頁第132頁第133頁第134頁第135頁第136頁
MB91635A Series
44
DS07-16909-2E
2.
Precautions for Package Mounting
Package mounting may be either lead insertion type or surface mount type. In either case, for heat resistance
during soldering, you should only mount under FUJITSU SEMICONDUCTOR's recommended conditions. For
detailed information about mount conditions, contact your sales representative.
Lead Insertion Type
Mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct
soldering on the board, or mounting by using a socket.
Direct mounting onto boards normally involves processes for inserting leads into through-holes on the board
and using the flow soldering (wave soldering) method of applying liquid solder.
In this case, the soldering process usually causes leads to be subjected to thermal stress in excess of the
absolute ratings for storage temperature. Mounting processes should conform to recommended mounting con-
ditions.
If socket mounting is used, differences in surface treatment of the socket contacts and IC lead surfaces can lead
to contact deterioration after long periods. For this reason it is recommended that the surface treatment of socket
contacts and IC leads be verified before mounting.
Surface Mount Type
Surface mount packaging has longer and thinner leads than lead-insertion packaging, and therefore leads are
more easily deformed or bent. The use of packages with higher pin counts and narrower pin pitch results in
increased susceptibility to open connections caused by deformed pins, or shorting due to solder bridges.
You must use appropriate mounting techniques. FUJITSU SEMICONDUCTOR recommends the solder reflow
method, and has established a ranking of mounting conditions for each product. Users are advised to mount
packages in accordance with FUJITSU SEMICONDUCTOR ranking of recommended conditions.
Lead-Free Packaging
Note: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering,
junction strength may be reduced under some conditions of use.
Storage of Semiconductor Devices
Because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will
cause absorption of moisture. During mounting, the application of heat to a package that has absorbed moisture
can cause surfaces to peel, reducing moisture resistance and causing packages to crack. To prevent, do the
following:
(a) Avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. Store
products in locations where temperature changes are slight.
(b) Use dry boxes for product storage. Products should be stored below 70% relative humidity, and at temper-
atures between +5
°C and +30 °C. When you open Dry Package that recommends humidity 40% to 70%
relative humidity.
(c) When necessary, FUJITSU SEMICONDUCTOR packages semiconductor devices in highly moisture-resis-
tant aluminum laminate bags, with a silica gel desiccant. Devices should be sealed in their aluminum laminate
bags for storage.
(d) Avoid storing packages where they are exposed to corrosive gases or high levels of dust.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MB91F224SPFV-GSE1 | 32-BIT, FLASH, 32 MHz, RISC MICROCONTROLLER, PQFP144 |
| MB91F312APFV-1XX-BND-E1 | 32-BIT, FLASH, 40.54 MHz, RISC MICROCONTROLLER, PQFP144 |
| MB91FV310APFV-ES | RISC MICROCONTROLLER, PQFP144 |
| MB91F312APFV-G-010E1 | RISC MICROCONTROLLER, PQFP144 |
| MB91F313APMC-GE1 | 32-BIT, FLASH, 33 MHz, RISC MICROCONTROLLER, PQFP120 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MB-9-187 | 功能描述:MOUNTING BUTTON 9/32 TO 11/32 RoHS:是 類別:硬件，緊固件，配件 >> 鉚釘 系列:MB 產(chǎn)品培訓(xùn)模塊:Rivets and Hardware Engineering Technology Injection Molding and Plastics Plastic Materials 標(biāo)準(zhǔn)包裝:1,000 系列:SR 類型:卡入式 鉚釘直徑:0.197"（5.00mm） 接頭直徑:0.354"（8.99mm） 鉚釘長度:0.260"（6.60mm） 孔直徑:0.203"（5.16mm） 面板厚度:0.098 ~ 0.138"（2.49 ~ 3.51mm） 接頭高度:0.087"（2.21mm） 特點(diǎn):阻燃 顏色:黑 材質(zhì):尼龍 其它名稱:61100367SRVO-5055 BSRVO-5055 B-NDSRVO5055B |
| MB91F109 | 制造商:FUJITSU 制造商全稱:Fujitsu Component Limited. 功能描述:32-bit RISC Microcontroller |
| MB91F109PF | 制造商:FUJITSU 制造商全稱:Fujitsu Component Limited. 功能描述:32-bit RISC Microcontroller |
| MB91F109PFR-GE1 | 制造商:FUJITSU 功能描述: |
| MB91F109PFV | 制造商:FUJITSU 制造商全稱:Fujitsu Component Limited. 功能描述:32-bit RISC Microcontroller |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。