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參數(shù)資料
| 型號： | MAXQ610X-0000+ |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 28/29頁 |
| 文件大?。?/td> | 0K |
| 描述： | MCU 16BIT W/IR MODULE BARE DIE |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 100 |
| 系列： | MAXQ® |
| 核心處理器： | RISC |
| 芯體尺寸： | 16-位 |
| 速度： | 12MHz |
| 連通性： | SPI，UART/USART |
| 外圍設(shè)備： | 欠壓檢測/復(fù)位，紅外線，電源故障，POR，WDT |
| 輸入/輸出數(shù)： | 32 |
| 程序存儲器容量： | 64KB（64K x 8） |
| 程序存儲器類型： | 閃存 |
| RAM 容量： | 2K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 1.7 V ~ 3.6 V |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 模具 |
| 包裝： | 托盤 |
| 其它名稱： | 90-M6800+D00 |
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MAXQ610
16-Bit Microcontroller with Infrared Module
8
_______________________________________________________________________________________
Pin Description
PIN
32 TQFN
40 TQFN
44 TQFN
NAME
FUNCTION
POWER PINS
15, 29
18, 38
19, 41
VDD
Supply Voltage
13, 22, 30
—
17, 20,
28, 42
GND
Ground. These pins must be directly connected to the ground plane. The 40-pin
TQFN package does not have any ground pins and connects to ground through
the exposed pad.
14
17
18
REGOUT
Regulator Capacitor. This pin must be connected to ground through a 1.0μF
external ceramic-chip capacitor. The capacitor must be placed as close to this
pin as possible. No devices other than the capacitor should be connected to
this pin.
—
EP
Exposed Pad. For the 32-pin TQFN package, leave unconnected.
For the 40-pin TQFN package, the exposed pad is internally connected to GND.
Connect to the ground plane.
For the 44-pin TQFN package, the EP has no internal connection to the device.
Leave unconnected. Not intended as an electrical connection point.
RESET PINS
28
37
40
RESET
Digital, Active-Low, Reset Input/Output. The CPU is held in reset when this pin
is low and begins executing from the reset vector when released. The pin
includes pullup current source and should be driven by an open-drain, external
source capable of sinking in excess of 4mA. This pin is driven low as an output
when an internal reset condition occurs.
CLOCK PINS
18
21
23
HFXIN
19
22
24
HFXOUT
High-Frequency Crystal Input. Connect external crystal or resonator between
HFXIN and HFXOUT as the high-frequency system clock. Alternatively, HFXIN is
the input for an external, high-frequency clock source when HFXOUT is
unconnected.
IR FUNCTION PINS
31
39
43
IRTX
IR Transmit Output. IR transmit pin capable of sinking 25mA. This pin defaults
to high-impedance input with the weak pullup disabled during all forms of reset.
Software must configure this pin after release from reset to remove the high-
impedance input condition.
32
40
44
IRRX
IR Receive Input. IR receive pin. This pin defaults to high-impedance input with
the weak pullup disabled during all forms of reset. Software must configure this
pin after release from reset to remove the high-impedance input condition.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAXQ610X-0000+ | 功能描述:MCU 16BIT W/IR MODULE BARE DIE RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:MAXQ® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:260 系列:73S12xx 核心處理器:80515 芯體尺寸:8-位 速度:24MHz 連通性:I²C，智能卡，UART/USART，USB 外圍設(shè)備:LED，POR，WDT 輸入/輸出數(shù):9 程序存儲器容量:64KB（64K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:2K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:68-VFQFN 裸露焊盤 包裝:管件 |
| MAXQ610X-0001+ | 功能描述:MAXQ610X PROG TESTED DIE WAFFLE RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:MAXQ® 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:260 系列:73S12xx 核心處理器:80515 芯體尺寸:8-位 速度:24MHz 連通性:I²C，智能卡，UART/USART，USB 外圍設(shè)備:LED，POR，WDT 輸入/輸出數(shù):9 程序存儲器容量:64KB（64K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:2K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:68-VFQFN 裸露焊盤 包裝:管件 |
| MAXQ610X-2001+ | 功能描述:16位微控制器 - MCU RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時(shí)鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT |
| MAXQ610X-2021+ | 制造商:Maxim Integrated Products 功能描述:16-BIT MICROCONTROLLER WITH INFRARED MODULE - Gel-pak, waffle pack, wafer, diced wafer on film |
| MAXQ610X-UEI+ | 制造商:Maxim Integrated Products 功能描述:MAXQ610 BLANK WLP UEI - Gel-pak, waffle pack, wafer, diced wafer on film |
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