- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄383549 > MAX9981EVKIT (Maxim Integrated Products, Inc.) Evaluation Kit for the MAX9981 PDF資料下載
參數(shù)資料
| 型號： | MAX9981EVKIT |
| 廠商： | Maxim Integrated Products, Inc. |
| 英文描述： | Evaluation Kit for the MAX9981 |
| 中文描述： | MAX9981評估板 |
| 文件頁數(shù)： | 4/8頁 |
| 文件大小： | 315K |
| 代理商： | MAX9981EVKIT |
E
MAX9981 Evaluation Kit
4
_______________________________________________________________________________________
3dB
3dB
LO2
RFMAIN
LO1
+5V
GND
IFMAIN
771.000MHz
RF SIGNAL GENERATOR
(HP 8648B)
770.000MHz
RF SIGNAL GENERATOR
(HP 8648B)
(AMMETER)
291mA
BENCH MULTIMETER
(HP 34401A)
5.0V 500mA (MAX)
POWER SUPPLY
(AG E3631A)
870.000MHz
RF SIGNAL GENERATOR
(HP 8648B)
RF SPECTRUM ANALYZER
(HP 8561x)
RFDIV
IFDIV
RF HIGH-
POWER SENSOR
RF POWER METER
(GIGA 80701A, HP 437B)
50
50
3dB
3dB
LOSEL
OPEN = LO1
GND = LO2
MAX9981
U1
Figure 1. MAX9981 EV Kit Main Mixer Test Setup Diagram
Layout Considerations
The MAX9981 evaluation board can be a guide for your
board layout. Pay close attention to thermal design and
close placement of parts to the IC. The MAX9981 pack-
age exposed paddle (EP), conducts heat from the part
and provides a low-impedance electrical connection.
The EP must be attached to the PC board ground plane
with a low thermal and electrical impedance contact.
Ideally, this can be achieved by soldering the backside
package contact directly to a top metal ground plane on
the PC board. Alternatively, the EP can be connected to
a ground plane using an array of plated vias directly
below the EP.
Depending on the ground plane spacing, large sur-
face-mount pads in the IF path may need to have the
ground plane relieved under them to reduce shunt
capacitance.
相關PDF資料 |
PDF描述 |
|---|---|
| MAX963 | Low-Noise.Precision Op Amp[MXL1007/MXL1007ACN8/MXL1007AMH/MXL1007AMJ8/MXL1007CN8/MXL1007CS/MXL1007CS-T/MXL1007CS8/MXL1007CS8-T/MXL1007MH/MXL1007MJ8 ] |
| MAX990 | Micropower.Low-Voltage.UCSP/SC70.Rail-to-Rail I/O Comparators |
| MAX994 | 1Gbps.High-Speed Limiting Amplifier with Chatter-Free Loss of Signal Detection[MAX3262/MAX3262C/D/MAX3262CAG/MAX3262CAG-T ] |
| MAX9990ETP | Analog Miscellaneous |
| MAX9990EVKIT | Evaluation Kits for the MAX9989/MAX9990 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MAX9982ETP | 功能描述:射頻混合器 825-915MHz Dual SiGe Active Mixer RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| MAX9982ETP+ | 功能描述:射頻混合器 825-915MHz Dual SiGe Active Mixer RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| MAX9982ETP+D | 功能描述:射頻混合器 825-915MHz Dual SiGe Active Mixer RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| MAX9982ETP+T | 功能描述:射頻混合器 825-915MHz Dual SiGe Active Mixer RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| MAX9982ETP+TD | 功能描述:射頻混合器 825-915MHz Dual SiGe Active Mixer RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
發(fā)布緊急采購，3分鐘左右您將得到回復。