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| 型號： | MAX9944ATA+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 8/15頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC OPAMP PREC LP/HV DL 8TDFN-EP |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 放大器類型： | 通用 |
| 電路數(shù)： | 2 |
| 輸出類型： | 滿擺幅 |
| 轉(zhuǎn)換速率： | 0.35 V/µs |
| 增益帶寬積： | 2.4MHz |
| 電流 - 輸入偏壓： | 4nA |
| 電壓 - 輸入偏移： | 20µV |
| 電流 - 電源： | 550µA |
| 電流 - 輸出 / 通道： | 20mA |
| 電壓 - 電源，單路/雙路(±)： | 6 V ~ 38 V，±3 V ~ 19 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-WDFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 8-TDFN-EP（3x3） |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 其它名稱： | MAX9944ATA+TDKR |
MAX9943/MAX9944
High-Voltage, Precision, Low-Power Op Amps
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Supply Voltage (VCC to VEE) ..................................-0.3V to +40V
All Other Pins (Note 1) .....................(VEE - 0.3V) to (VCC + 0.3V)
OUT Short-Circuit Current Duration
8-Pin μMAX (VCC - VEE ≤ 20V)...............................................3s
8-Pin μMAX (VCC - VEE > 20V) ................................Momentary
6-Pin TDFN (VCC - VEE ≤ 20V) .............................................60s
6-Pin TDFN (VCC - VEE > 20V)...............................................2s
8-Pin SO (VCC - VEE ≤ 20V) .................................................60s
8-Pin SO (VCC - VEE > 20V)...................................................2s
8-Pin TDFN (VCC - VEE ≤ 20V) .............................................60s
8-Pin TDFN (VCC - VEE > 20V)...............................................2s
Continuous Input Current (Any Pins) ................................±20mA
Thermal Limits (Note 2)
Multiple Layer PCB
Continuous Power Dissipation (TA = +70°C)
8-Pin μMAX (derate 4.8mW/°C above +70°C) ...........387.8mW
6-Pin TDFN-EP (derate 23.8mW/°C above +70°C) ..1904.8mW
8-Pin SO (derate 7.6mW/°C above +70°C)...................606.1W
8-Pin TDFN-EP (derate 24.4mW/°C above +70°C) ..1951.2mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Operating Supply Voltage Range
VSUPPLY
Guaranteed by PSRR test
±3
±19
V
Quiescent Supply Current per
Amplifier
ICC
550
950
μA
Power-Supply Rejection Ratio
PSRR
VS =
±3V to ±19V
105
130
dB
TA = +25
°C
20
100
Input Offset Voltage
VOS
TA = -40
°C to +125°C
240
μV
Input Offset Voltage Drift
TCVOS
0.4
μV/
°C
VEE + 0.3V
≤ VCM ≤ VCC - 1.8V
4
20
Input Bias Current
IBIAS
VEE
≤ VCM ≤ VCC - 1.8V
90
nA
Input Offset Current
IOS
VEE
≤ VCM ≤ VCC - 1.8V
1
10
nA
Input Voltage Range
VIN+ , VIN-
Guaranteed by CMRR test,
TA = -40
°C to +125°C
VEE
VCC -
1.8
V
VEE + 0.3V
≤ VCM ≤ VCC - 1.8V
105
125
Common-Mode Rejection Ratio
CMRR
VEE
≤ VCM ≤ VCC - 1.8V
105
dB
ELECTRICAL CHARACTERISTICS
(VCC = 15V, VEE = -15V, VCM = 0V, RL = 10kΩ to GND, VGND = 0V, TA = -40°C to +125°C. Typical values are at TA = +25°C, unless
otherwise noted.) (Note 3)
Note 1: Operation is limited by thermal limits.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
8 μMAX
Junction-to-Ambient Thermal Resistance (
θJA)......206.3°C/W
Junction-to-Ambient Case Resistance (
θJC) ...............42°C/W
6 TDFN-EP
Junction-to-Ambient Thermal Resistance (
θJA)...........42°C/W
Junction-to-Ambient Case Resistance (
θJC) .................9°C/W
8 SO
Junction-to-Ambient Thermal Resistance (
θJA).........132°C/W
Junction-to-Ambient Case Resistance (
θJC) ...............38°C/W
8 TDFN-EP
Junction-to-Ambient Thermal Resistance (
θJA)...........41°C/W
Junction-to-Ambient Case Resistance (
θJC) .................8°C/W
PACKAGE THERMAL CHARACTERISTICS (Note 2)
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