參數(shù)資料
型號(hào): MAX98303EWE+T
廠商: Maxim Integrated Products
文件頁數(shù): 2/13頁
文件大?。?/td> 0K
描述: IC AMP AUDIO 3.1W STEREO D 16WLP
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 2,500
類型: D 類
輸出類型: 2 通道(立體聲)
在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量: 3.1W x 2 @ 4 歐姆
電源電壓: 2.6 V ~ 5.5 V
特點(diǎn): 消除爆音,差分輸入,短路和熱保護(hù),關(guān)閉
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: 16-WLP(1.68x1.68)
封裝/外殼: 16-WFBGA,WLBGA
包裝: 帶卷 (TR)
10 _____________________________________________________________________________________
MAX98303
Stereo 3.1W Class D Amplifier
Applications Information
Filterless Class D Operation
Traditional Class D amplifiers require an output filter.
The filter adds cost and size and decreases THD perfor-
mance. The IC’s filterless modulation scheme does not
require an output filter.
Because the switching frequency of the IC is well
beyond the bandwidth of most speakers, voice coil
movement due to the switching frequency is very small.
Use a speaker with a series inductance > 10FH. Typical
8I speakers exhibit series inductances in the 20FH to
100FH range.
Component Selection
Power-Supply Input (PVDD)
PVDD powers the speaker amplifier. PVDD ranges from
2.6V to 5.5V. Bypass PVDD with 0.1FF and 10FF capaci-
tors to PGND. Apply additional bulk capacitance at the
device if long input traces between PVDD and the power
source are used.
Input Filtering
The input-coupling capacitor (CIN), in conjunction with
the amplifier’s internal input resistance (RIN), forms a
highpass filter that removes the DC bias from the incom-
ing signal. These capacitors allow the amplifier to bias
the signal to an optimum DC level.
Assuming zero source impedance with a gain setting of
12dB, 15dB, or 18dB, CIN is:
IN
3dB
8
C
[ F]
f
=
with a gain setting of 9dB, CIN is:
IN
3dB
5.7
C
[ F]
f
=
with a gain setting of 6dB, CIN is:
IN
3dB
4
C
[ F]
f
=
where f-3dB is the -3dB corner frequency. Use capaci-
tors with adequately low-voltage coefficients for best
low-frequency THD performance.
Layout and Grounding
Proper layout and grounding are essential for optimum
performance. Good grounding improves audio perfor-
mance and prevents switching noise from coupling into
the audio signal.
Use wide, low-resistance output traces. As the load
impedance decreases, the current drawn from the
device increases. At higher current, the resistance of the
output traces decrease the power delivered to the load.
For example, if 2W is delivered from the device output to
a 4I load through 100mI of total speaker trace, 1.904W
is delivered to the speaker. If power is delivered through
10mI of total speaker trace, 1.99W is delivered to the
speaker. Wide output, supply, and ground traces also
improve the power dissipation of the device.
The IC is inherently designed for excellent RF immunity.
For best performance, add ground fills around all signal
traces on top or bottom PCB planes.
WLP Applications Information
For the latest application details on WLP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow tempera-
ture profile, as well as the latest information on reliability
testing results, refer to Application Note 1891: Wafer
level packaging (WLP) and its applications. Figure 2
shows the dimensions of the WLP balls used on the IC.
Figure 2. MAX98303 WLP Ball Dimensions
0.24mm
0.21mm
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