參數(shù)資料
型號: MAX9766ETJ+T
廠商: Maxim Integrated Products
文件頁數(shù): 18/33頁
文件大?。?/td> 0K
描述: IC AMP AUDIO .75W MONO AB 32TQFN
標(biāo)準(zhǔn)包裝: 2,500
類型: AB 類
輸出類型: 1-通道(單聲道),帶立體聲耳機
在某負載時最大輸出功率 x 通道數(shù)量: 750mW x 1 @ 4 歐姆; 65mW x 2 @ 16 歐姆
電源電壓: 2.7 V ~ 5.5 V
特點: 消除爆音,I²C,輸入多路復(fù)用器,麥克風(fēng),靜音,短路和熱保護,關(guān)機
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: 32-TQFN-EP(5x5)
封裝/外殼: 32-WFQFN 裸露焊盤
包裝: 帶卷 (TR)
MAX9765/MAX9766/MAX9767
750mW Audio Amplifiers with Headphone Amp,
Microphone Preamp, and Input Mux
______________________________________________________________________________________
25
Output-Coupling Capacitor
The MAX9765/MAX9766/MAX9767 require output-cou-
pling capacitors to operate in single-ended (head-
phone) mode. The output-coupling capacitor blocks the
DC component of the amplifier output, preventing DC
current from flowing to the load. The output capacitor
and the load impedance form a highpass filter with a
-3dB point determined by:
As with the input capacitor, choose COUT such that
f-3dB is well below the lowest frequency of interest.
Setting f-3dB too high affects the amplifier‘s low-fre-
quency response.
Load impedance is a concern when choosing COUT.
Load impedance can vary, changing the -3dB point of
the output filter. A lower impedance increases the cor-
ner frequency, degrading low-frequency response.
Select COUT such that the worst-case load/COUT com-
bination yields an adequate response. Select capaci-
tors with low ESR.
BIAS Capacitor
BIAS is the output of the internally generated 1.5VDC
bias voltage. The BIAS bypass capacitor, CBIAS,
improves PSRR and THD+N by reducing power supply
and other noise sources at the common-mode bias
node, and also generates the clickless/popless, start-
up/shutdown DC bias waveforms for the speaker ampli-
fiers. Bypass BIAS with a 1F capacitor to GND.
Smaller capacitor values produce faster turn-on/off
times and may impact the click/pop levels.
Supply Bypassing
Proper power-supply bypassing ensures low-noise,
low-distortion performance. Place a 0.1F ceramic
capacitor from VDD to GND. Add additional bulk
capacitance as required by the application. Bypass
PVDD with a 100F capacitor to GND. Locate bypass
capacitors as close to the device as possible.
Layout and Grounding
Good PC board layout is essential for optimizing perfor-
mance. Use large traces for the power-supply inputs
and amplifier outputs to minimize losses due to para-
sitic trace resistance, as well as route heat away from
the device. Good grounding improves audio perfor-
mance, minimizes crosstalk between channels, and
prevents any digital switching noise from coupling into
the audio signal. If digital signal lines must cross over
or under audio signal lines, ensure that they cross per-
pendicular to each other.
The MAX9765/MAX9766/MAX9767 thin QFN packages
feature exposed thermal pads on their undersides. This
pad lowers the package’s thermal resistance by provid-
ing a direct heat conduction path from the die to the
printed circuit board. Connect the pad to signal ground
by using a large pad, or multiple vias to the ground
plane.
f
RC
dB
L OUT
=
3
1
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