- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄384714 > MAX9750CETI (MAXIM INTEGRATED PRODUCTS INC) 2.6W Stereo Audio Power Amplifiers and DirectDrive Headphone Amplifiers PDF資料下載
參數(shù)資料
| 型號： | MAX9750CETI |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 2.6W Stereo Audio Power Amplifiers and DirectDrive Headphone Amplifiers |
| 中文描述： | 2.2 W, 2 CHANNEL, AUDIO AMPLIFIER, QCC28 |
| 封裝： | 5 X 5 MM, 0.80 MM HEIGHT, TQFN-28 |
| 文件頁數(shù)： | 21/31頁 |
| 文件大?。?/td> | 673K |
| 代理商： | MAX9750CETI |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁當(dāng)前第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁
M
2.6W Stereo Audio Power Amplifiers and
DirectDrive Headphone Amplifiers
______________________________________________________________________________________
21
Output Capacitor (C2)
The output capacitor value and ESR directly affect the
ripple at CPV
SS
. Increasing the value of C2 reduces
output ripple. Likewise, decreasing the ESR of C2
reduces both ripple and output resistance. Lower
capacitance values can be used in systems with low
maximum output power levels. See the Output Power
vs. Charge-Pump Capacitance and Load Resistance
graph in the
Typical Operating Characteristics
.
CPV
DD
Bypass Capacitor
The CPV
DD
bypass capacitor (C3) lowers the output
impedance of the power supply and reduces the
impact of the MAX9750/MAX9751/MAX9755’s charge-
pump switching transients. Bypass CPV
DD
with C3, the
same value as C1, and place it physically close to
CPV
DD
and PGND (refer to the MAX9750 Evaluation Kit
for a suggested layout).
Powering Other Circuits from a
Negative Supply
An additional benefit of the MAX9750/MAX9751/
MAX9755 is the internally generated negative supply
voltage (CPV
SS
). CPV
SS
is used by the MAX9750/
MAX9751/MAX9755 to provide the negative supply for
the headphone amplifiers. It can also be used to power
other devices within a design. Current draw from
CPV
SS
should be limited to 5mA, exceeding this affects
the operation of the headphone amplifier. A typical
application is a negative supply to adjust the contrast
of LCD modules.
When considering the use of CPV
SS
in this manner,
note that the charge-pump voltage of CPV
SS
is roughly
proportional to CPV
DD
and is not a regulated voltage.
The charge-pump output impedance plot appears in
the
Typical Operating Characteristics
.
Layout and Grounding
Proper layout and grounding are essential for optimum
performance. Use large traces for the power-supply
inputs and amplifier outputs to minimize losses due to
parasitic trace resistance, as well as route head away
from the device. Good grounding improves audio per-
formance, minimizes crosstalk between channels, and
prevents any switching noise from coupling into the
audio signal. Connect CPGND, PGND and GND
together at a single point on the PC board. Route
CPGND and all traces that carry switching transients
away from GND, PGND, and the traces and compo-
nents in the audio signal path.
Connect all components associated with the charge
pump (C2 and C3) to the CPGND plane. Connect V
SS
and CPV
SS
together at the device. Place the charge-
pump capacitors (C1, C2, and C3) as close to the
device as possible. Bypass HPV
DD
and PV
DD
with a
0.1μF capacitor to GND. Place the bypass capacitors
as close to the device as possible.
Use large, low-resistance output traces. As load imped-
ance decreases, the current drawn from the device out-
puts increase. At higher current, the resistance of the
output traces decrease the power delivered to the load.
For example, when compared to a 0
trace, a 100m
trace reduces the power delivered to a 4
load from
2.1W to 2W. Large output, supply, and GND traces also
improve the power dissipation of the device.
The MAX9750/MAX9751/MAX9755 thin QFN and
TSSOP-EP packages feature exposed thermal pads on
their undersides. This pad lowers the package’s ther-
mal resistance by providing a direct heat conduction
path from the die to the printed circuit board. Connect
the exposed thermal pad to GND by using a large pad
and multiple vias to the GND plane.
MAX9750
INR
INL
1
μ
F
1
μ
F
22nF
OUTL+
OUTL-
OUTR+
OUTR-
OUT-
OUT+
22
μ
F
22
μ
F
10nF
20k
20k
IN
10k
10k
MAX9711
Figure 11. Stereo Plus Subwoofer Application Circuit
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MAX9750CEUI | 2.6W Stereo Audio Power Amplifiers and DirectDrive Headphone Amplifiers |
| MAX9750AETI | 2.6W Stereo Audio Power Amplifiers and DirectDrive Headphone Amplifiers |
| MAX9750AEUI | 2.6W Stereo Audio Power Amplifiers and DirectDrive Headphone Amplifiers |
| MAX9750BETI | 2.6W Stereo Audio Power Amplifiers and DirectDrive Headphone Amplifiers |
| MAX9759 | 3.2W, High-Efficiency, Low-EMI, Filterless, Class D Audio Amplifier |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX9750CETI+ | 功能描述:音頻放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9750CETI+C2U | 功能描述:音頻放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9750CETI+T | 功能描述:音頻放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9750CEUI | 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述: |
| MAX9751ETI+ | 功能描述:音頻放大器 Integrated Circuits (ICs) RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。