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參數(shù)資料
| 型號(hào)： | MAX9730EVKIT+ |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 2/12頁 |
| 文件大?。?/td> | 0K |
| 描述： | EVALUATION KIT FOR MAX9730 |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 放大器類型： | G 類 |
| 輸出類型： | 1-通道（單聲道） |
| 在某負(fù)載時(shí)最大輸出功率 x 通道數(shù)量： | 2.4W x 1 @ 8 歐姆 |
| 電源電壓： | 2.7 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 板類型： | 完全填充 |
| 已用 IC / 零件： | MAX9730 |
| 已供物品： | 板 |
MAX9730
Thermal Considerations
Class G amplifiers provide much better efficiency and
thermal performance than a comparable Class AB
amplifier. However, the system’s thermal performance
must be considered with realistic expectations and
include consideration of many parameters. This section
examines Class G amplifiers using general examples to
illustrate good design practices.
TQFN Considerations
The exposed pad is the primary route of keeping heat
away from the IC. With a bottom-side exposed pad, the
PCB and its copper become the primary heatsink for
the Class G amplifier. Solder the exposed pad to a
large copper polygon that is connected to the ground
plane.
The copper polygon to which the exposed pad is
attached should have multiple vias to the opposite side
of the PCB, where they connect to GND. Make this
polygon as large as possible within the system’s con-
straints.
WLP Applications Information
For the latest application details on WLP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow tempera-
ture profile, as well as the latest information on reliability
testing results, go to the Maxim website at www.maxim-
ic.com/ucsp for the application note,
UCSP—A Wafer-
Level Chip-Scale Package.
2.4W, Single-Supply, Class G Power Amplifier
10
______________________________________________________________________________________
Typical Application Circuit/Functional Diagram
MAX9730
+
IN+
FB+
1 (B2)
0.1
μF
4 (A3)
14, 22
(D1, D5)
RIN-
10k
Ω
VCC
RIN-
10k
Ω
CIN
1
μF
CIN
1
μF
IN-
20 (D2)
16 (D4)
FB-
OUT+
13 (C5)
( ) WLP PACKAGE
DEVICE SHOWN WITH AV = 12dB
*SYSTEM-LEVEL REQUIREMENT TYPICALLY 10
μF
FS
OUT-
10 (B5)
7 (A4)
9 (A5)
12 (B4)
18 (D3)
27 (A1)
26 (B1)
3 (A2) 24 (C1)
15, 21
(C2, C4)
-
CLASS G
OUTPUT
STAGE
CHARGE
PUMP
RFB+
10k
Ω
RFB-
10k
Ω
SHDN
CPGND
PVSS
SVSS
C1N
C1P
C2
10
μF
RFS
100k
Ω
GND
CPVDD
C1
4.7
μF
VDD
*
SHDN
CONTROL
SIGNAL
20k
Ω
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX9730EVKIT+ | 功能描述:音頻 IC 開發(fā)工具 MAX9730 Eval Kit RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Kits 類型:Audio Amplifiers 工具用于評估:TAS5614L 工作電源電壓:12 V to 38 V |
| MAX9730EWP+TG45 | 功能描述:音頻放大器 2.4W Class G Power Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9736AETJ/V+ | 功能描述:音頻放大器 Mono/Stereo Class D Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9736AETJ/V+T | 功能描述:音頻放大器 Mono/Stereo Class D Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| MAX9736AETJ+ | 功能描述:音頻放大器 Mono/Stereo Class D Amplifier RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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