
M
DisplayPort to DVI/HDMI Level Shifter
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
V
CC
to GND..............................................................-0.3V to +4V
All Pins to GND...........................................-0.3V to (V
CC
+ 0.3V)
Short-Circuit Duration (all outputs).............................Continuous
Continuous Power Dissipation (T
A
= +70°C)
32-Pin Thin QFN (derate 21.3mW/°C above +70°C) .1702mW
48-Pin Thin QFN (derate 27.8mW/°C above +70°C) .2222mW
Junction-to-Case Thermal Resistance (
θ
JC
) (Note 1)
32-Pin Thin QFN........................................................+1.7°C/W
48-Pin Thin QFN........................................................+0.8°C/W
Junction-to-Ambient Thermal Resistance (
θ
JA
) (Note 1)
32-Pin Thin QFN.........................................................+29°C/W
48-Pin Thin QFN.........................................................+25°C/W
DC ELECTRICAL CHARACTERISTICS
(V
CC
= 3V to 3.6V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
CC
= 3.3V, T
A
= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Operating Temperature Range ..…………………-40°C to +85°C
Junction Temperature………………………………………+150°C
Storage Temperature Range ……………………-65°C to +150°C
ESD Protection
Human Body Model (R
D
= 1.5k
Ω
, C
S
= 100pF)
IN_D_ and OUT_D_ to GND..........................................±1.5kV
Lead Temperature (soldering, 10s).………………………+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
OE
INPUT
Input High Level
Input Low Level
Input Current
DDC_EN INPUT
Input High Level
Input Low Level
Input Current
HPD INPUT AND OUTPUT
Input High Level
Input Low Level
Input Current
HPD_SNK Pulldown Resistance
Output High Level
Output Low Level
DIFFERENTIAL INPUTS (IN_)
Differential Input High Threshold
Differential Input Low Threshold
Common Input Voltage
Common-Mode AC Tolerance
Differential Input Termination
V
IH1
V
IL1
I
IN-EN
2.4
V
V
μA
0.5
V
IN
= 0 to V
CC
24
V
IH1
V
IL1
I
IN-DDC
2.4
V
V
μA
0.5
V
IN
= 0 to V
CC
100
V
IH2
V
IL2
I
IN2
R
HPD
V
OH-HPDB
V
OL-HPDB
2.4
5.3
0.8
V
V
μA
k
Ω
V
V
V
IN
= 0 to V
CC
80
60
40
2.5
0
V
CC
0.4
0.18
V
IDH
V
IDL
V
COM
V
C M _A C _P P
V
CM_AC_P-P
= (V
IN+
+ V
IN-
) / 2 - V
COD
R
IN
V
ID
= V
IN+
- V
IN-
V
ID
= V
IN+
- V
IN-
V
COD
= DC Avg [(V
IN+
+
V
IN-
) / 2]
50
mV
mV
V
mV
Ω
-50
0
1.43
2
100
60
40
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer board.
For detailed information on package thermal considerations, refer to Application Note 4083 at www.maxim-ic.com/thermal-tutorial.