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參數(shù)資料
| 型號： | MAX9060EBS+TG45 |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 3/10頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC COMPARATOR SGL LP 4UCSP |
| 產(chǎn)品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 1 |
| 類型： | 通用 |
| 元件數(shù)： | 1 |
| 輸出類型： | 開路漏極 |
| 電壓 - 電源，單路/雙路(±)： | 1 V ~ 5.5 V |
| 電壓 - 輸入偏移（最小值）： | 6mV @ 1.8V |
| 電流 - 輸入偏壓（最小值）： | 0.01µA @ 1.8V |
| 電流 - 靜態(tài)（最大值）： | 1.1µA |
| 傳輸延遲（最大）： | 25µs |
| 磁滯： | ±12mV |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 4-WFBGA，CSPBGA |
| 安裝類型： | 表面貼裝 |
| 包裝： | 標準包裝 |
| 其它名稱： | MAX9060EBS+TG45DKR |
MAX9060–MAX9064
Ultra-Small, Low-Power Single
Comparators in 4-Bump UCSP and 5 SOT23
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
MAX9060/MAX9061 ELECTRICAL CHARACTERISTICS
(VREF = 1.8V, RPULLUP PULLUP = 3.3V, TA = -40°C to +85°C. Typical values are at TA = +25°C, unless otherwise noted.)
(Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC, REF, IN to GND................................................-0.3V to +6V
OUT to GND (MAX9060–MAX9063).........................-0.3V to +6V
OUT to GND (MAX9064 Only) ................-0.3V to + (VCC + 0.3V)
Output Short-Circuit Current Duration ....................................10s
Input Current into Any Terminal........................................±20mA
Continuous Power Dissipation
4-Bump UCSP (derate 3.0mW/°C above +70°C) .......238 mW
5-Pin SOT23 (derate 3.9mW/°C above +70°C)...........312 mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (excluding UCSP, soldering, 10s).....+300°C
Soldering Temperature (reflow) .......................................+260°C
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
TA = +25°C
1.3
6
Input Offset Voltage
(Note 2)
VOS
9
mV
Hysteresis
VHYS
(Note 3)
±12
mV
Input Voltage Range
VIN
-0.3
+5.5
V
0V < VIN < VREF + 0.6V
40
Input Bias Current
IIN
VREF + 0.6V < VIN < 5.5V
10
100
nA
Input Shutdown Current
IIN_PD
VREF = 0V, VIN = 5.5V (Note 4)
< 0.1
27
nA
ISINK = 25A, VREF = 0.9V,
TA = +25°C
0.04
0.20
ISINK = 200A, VREF = 1.2V
0.08
0.20
ISINK = 500A, VREF = 1.8V
0.13
0.23
Output Voltage Low
VOL
ISINK = 1.2mA, VREF = 5.5V
0.19
0.50
V
Output Leakage Current
(OUT = High)
IOUT_LEAKAGE VPULLUP = 5.5V (Note 4)
< 0.1
35
nA
AC CHARACTERISTICS
Propagation Delay
tPD
Overdrive = ±100mV (Note 5)
25
s
Fall Time
tF
CL = 10pF
14
ns
REF SUPPLY
REF Voltage
VREF
Guaranteed by VOS tests
0.9
5.5
V
VREF = 0.9V, VIN = VREF,
TA = +25°C
50
100
VREF = 1.8V, VIN = VREF,
TA = +25°C
60
VREF = 5.5V, VIN = VREF,
TA = +25°C
170
320
REF Input Current
IREF
VREF = 5.5V, VIN = VREF,
-40°C < TA < +85°C
350
nA
REF Rejection Ratio
RRR
VREF = 0.9V to 5.5V, TA = +25°C
63
90
dB
Power-Up Time
tON
3ms
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