
M
Smallest TEC Power Drivers for
Optical Modules
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
V
DD
to GND..............................................................-0.3V to +6V
SHDN
, MAXV, MAXIP, MAXIN,
CTLI to GND.........................................................-0.3V to +6V
COMP, FREQ, OS1, OS2, CS, REF,
ITEC to GND...........................................-0.3V to (V
DD
+ 0.3V)
PV
DD
1, PV
DD
2 to GND...............................-0.3V to (V
DD
+ 0.3V)
PV
DD
1, PV
DD
2 to V
DD
...........................................-0.3V to +0.3V
PGND1, PGND2 to GND.......................................-0.3V to +0.3V
COMP, REF, ITEC Short to GND ...................................Indefinite
LX Current (Note 1) ........................................±2.25A LX Current
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Continuous Power Dissipation (T
A
= +70
°
C)
20-Pin 5mm x 5mm x 0.9mm QFN (derate 20.8mW/
°
C
above +70
°
C) (Note 2)...................................................1.67W
3mm x 3mm UCSP (derate 22mW/
°
C
above +70
°
C).................................................................1.75W
Maximum Junction Temperature .....................................+150
°
C
Storage Temperature Range.............................-65
°
C to +150
°
C
Lead Temperature (soldering 10s)..................................+300
°
C
ELECTRICAL CHARACTERISTICS
(V
DD
= PV
DD
1 = PV
DD
2 =
SHDN
= 5V, 1MHz mode (Note 3). PGND1 = PGND2 = GND, CTLI = MAXV = MAXIP = MAXIN = REF,
T
A
= 0°C to +85°C
, unless otherwise noted. Typical values at T
A
= +25
°
C.)
PARAMETER
SYMBOL
V
DD
CONDITIONS
MIN
3.0
±
1.5
1.485
TYP
MAX
5.5
UNITS
V
A
V
mV
Input Supply Range
Maximum TEC Current
Reference Voltage
Reference Load Regulation
V
REF
V
REF
V
DD
= 3V to 5.5V, I
REF
= 150μA
V
DD
= 3V to 5V, I
REF
= 10μA to 1mA
1.5
1.2
150
50
150
50
0.09
0.11
0.14
0.17
0.03
0.3
0.03
0.3
11
16
8
11
2
+165
2.65
2.55
1.515
5.0
160
60
155
55
0.14
0.16
0.23
0.30
4
V
MAXI_
= V
REF
V
MAXI_
= V
REF
/3
V
MAXI_
= V
REF
V
MAXI_
= V
REF
/3
140
40
143
45
V
DD
= 5V
MAXIP/MAXIN Threshold
Accuracy
V
DD
= 3V
mV
V
DD
= 5V, I = 0.2A
V
DD
= 3V, I = 0.2A
V
DD
= 5V, I = 0.2A
V
DD
= 3V, I = 0.2A
V
LX
= V
DD
= 5V, T
A
= +25
°
C
V
LX
= V
DD
= 5V, T
A
= +85
°
C
V
LX
= 0, T
A
= +25
°
C
V
LX
= 0, T
A
= +85
°
C
V
COMP
= V
REF
=
1.500V, V
DD
= 5V
NFET On-Resistance
R
DS(ON-N)
PFET On-Resistance
R
DS(ON-P)
NFET Leakage
I
LEAK(N)
μA
4
PFET Leakage
I
LEAK(P)
μA
500kHz mode
1MHz mode
500kHz mode
1MHz mode
14
21
11
14
3
No-Load Supply Current
I
DD(NO
LOAD)
V
COMP
= V
REF
=
1.500V, V
DD
= 3.3V
SHDN = GND, V
DD
= 5V (Note 4)
T
SHUTDOWN
Hysteresis = 15
°
C
V
DD
rising
V
UVLO
V
DD
falling
mA
Shutdown Supply Current
Thermal Shutdown
I
DD-SD
mA
°
C
2.50
2.40
2.80
2.70
UVLO Threshold
V
Note 1:
LX has internal clamp diodes to PGND and PVDD. Applications that forward bias these diodes should take care not to exceed
the IC
’
s package power dissipation limits.
Note 2:
Solder underside metal slug to PC board ground plane.