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參數(shù)資料
| 型號： | MAX7358EUG+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 12/22頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MULTIPLEXER 8X1 24TSSOP |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 功能： | 多路復(fù)用器 |
| 電路： | 1 x 8:1 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 2.3 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 24-TSSOP |
| 包裝： | 帶卷 (TR) |
MAX7356/MAX7357/MAX7358
1-to-8 I2C Bus Switches/Multiplexers with Bus
Lock-Up Detection, Isolation, and Notification
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS (3.3V SUPPLY)
(VDD = +2.3V to +3.6V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VDD = +3.3V, TA = +25°C.) (Notes 2–5)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
(Voltages referenced to GND.)
VDD .................................................................. -0.3V to +6.0V
All Other Pins.....................................................-0.3V to +6.0V
Input Currents
VDD ...............................................................................100mA
GND ..............................................................................100mA
All Input Pins.....................................................................±20mA
Output Current ....................................................................25mA
Continuous Power Dissipation (TA = +70°C)
24-Pin TSSOP (derate 13.9mW/°C above +70°C) .....1111mW
24-Pin TQFN (derate 27.8mW/°C above +70°C) .......2222mW
Junction-to-Case Thermal Resistance (
θJC) (Note 1)
24-Pin TSSOP...............................................................13°C/W
24-Pin TQFN................................................................3.0°C/W
Junction-to-Ambient Thermal Resistance (
θJA) (Note 1)
24-Pin TSSOP............................................................72.0°C/W
24-Pin TQFN..............................................................36.0°C/W
Operating Temperature Range ......................... -40°C to +85°C
Junction Temperature .................................................... +150°C
Storage Temperature Range ........................... -65°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY
Supply Voltage
VDD
2.3
3.6
V
Basic mode
30
50
Supply Current
IDD
VDD = 3.6V;
no load, fSCL =
400kHz
Enhanced mode
(MAX7357/MAX7358 only)
45
70
A
Standby Current
ISTB
No load, VI = VDD or GND, VDD = 3.6V
0.1
1
A
Power-On Reset Voltage
VPOR
VDD rising
0.9
1.4
2.1
V
Power-On Reset Hysteresis
VHYST
0.4
V
INPUT SCL, INPUT/OUTPUT SDA
Low-Level Input Voltage
VIL
0.3 x
VDD
V
High-Level Input Voltage
VIH
0.7 x
VDD
V
VOL = 0.4V
3
Low-Level Output Current
IOL
VOL = 0.6V
6
mA
Input Leakage Current
ILH, ILI
VSCL and VSDA = VDD or GND
-1
+1
A
Input Capacitance
CI
VI = GND
15
pF
SELECT INPUTS A0 to A2,
RST
Low-Level Input Voltage
VIL
0.3 x
VDD
V
High-Level Input Voltage
VIH
0.7 x
VDD
V
Input Leakage Current
ILI
A0 to A2, and
RST at VDD or GND
-1
+1
A
Input Capacitance
CI
VI = GND
2
pF
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