參數(shù)資料
型號: MAX6693UP9A+T
廠商: Maxim Integrated
文件頁數(shù): 2/19頁
文件大小: 168K
描述: IC TEMP MONITOR 7CH 20-TSSOP
產(chǎn)品培訓模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標準包裝: 2,500
功能: 溫度監(jiān)控系統(tǒng)(傳感器)
傳感器類型: 內(nèi)部和外部
感應溫度: -40°C ~ 125°C,外部傳感器
精確度: ±3°C 本地(最大),±4°C 遠程(最大)
拓撲: ADC,緩沖器,多路復用器,寄存器庫
輸出類型: SMBus?
輸出警報:
輸出風扇:
電源電壓: 3 V ~ 3.6 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 20-TSSOP(0.173",4.40mm 寬)
供應商設備封裝: 20-TSSOP
包裝: 帶卷 (TR)
7-Channel Precision Temperature Monitor
with Beta Compensation
2  _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC
, SMBCLK, SMBDATA, ALERT, OVERT,
STBY to GND ....................................................-0.3V to +6.0V
DXP_ to GND..............................................-0.3V to (V
CC
+ 0.3V)
DXN_ to GND ........................................................-0.3V to +0.8V
SMBDATA, ALERT, OVERT Current....................-1mA to +50mA
DXN_ Current......................................................................?mA
Continuous Power Dissipation (T
A
= +70癈)
20-Pin TSSOP
(derate 13.6mW/癈 above +70癈).............................1084mW
Junction-to-Case Thermal Resistance (?/DIV>
JC
) (Note 1)
20-Pin TSSOP...............................................................20癈/W
Junction-to-Ambient Thermal Resistance (?/DIV>
JA
) (Note 1)
20-Pin TSSOP............................................................73.8癈/W
ESD Protection (all pins, Human Body Model) ....................?kV
Operating Temperature Range .........................-40癈 to +125癈
Junction Temperature......................................................+150癈
Storage Temperature Range.............................-65癈 to +150癈
Lead Temperature (soldering, 10s).................................+300癈
ELECTRICAL CHARACTERISTICS
(V
CC
= +3.0V to +3.6V, V
STBY
= V
CC
, T
A
= -40癈 to +125癈, unless otherwise noted. Typical values are at V
CC
= +3.3V and T
A
=
+25癈.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
V
CC
3.0
3.6
V
Software Standby Supply Current
I
SS
SMBus static
3
10
Operating Current
I
CC
During conversion (Note 3)
500
2000
Channel 1 only
11
Temperature Resolution
Other diode channels
8
Bits
T
A
 = T
RJ
 = +60癈 to +100癈
-1.5
+1.5
3 ?Temperature Accuracy
(Remote Channel 1)
V
CC
 = 3.3V,
?= 0.5
T
A
 = T
RJ
 = 0癈 to +125癈
-2.375
+2.375
T
A
 = T
RJ
 = +60癈 to +100癈
-2
+2
3 ?Temperature Accuracy
(Remote Channels 26)
V
CC
 = 3.3V
T
A
 = T
RJ
 = 0癈 to +125癈
-2.5
+2.5
T
A
 = +60癈 to +100癈
-2
+2
3 ?Temperature Accuracy
(Local)
V
CC
 = 3.3V
T
A
= 0癈 to +125癈
-2.5
+2.5
T
A
 = T
RJ
 = +60癈 to +100癈
-3
+3
6 ?Temperature Accuracy
(Remote Channel 1)
V
CC
 = 3.3V,
?= 0.5
T
A
 = T
RJ
 = 0癈 to +125癈
-4
+4
T
A
 = T
RJ
 = +60癈 to +100癈
-3
+3
6 ?Temperature Accuracy
(Remote Channels 26)
V
CC
 = 3.3V
T
A
 = T
RJ
 = 0癈 to +125癈
-3.5
+3.5
T
A
 = +60癈 to +100癈
-2.5
+2.5
6 ?Temperature Accuracy
(Local)
V
CC
 = 3.3V
T
A
= 0癈 to +125癈
-3
+3
Supply Sensitivity of Temperature
Accuracy
?.2
o
C/V
Remote Channel 1 Conversion
Time
t
CONV1
190
250
312
ms
Remote Channels 26
Conversion Time
t
CONV_
95
125
156
ms
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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