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參數資料
| 型號： | MAX6627MKA-T |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 溫度/濕度傳感器 |
| 英文描述： | Remote 【1∑C Accurate Digital Temperature Sensors with SPI-Compatible Serial Interface |
| 中文描述： | DIGITAL TEMP SENSOR-SERIAL, 12BIT(s), 5.50Cel, RECTANGULAR, SURFACE MOUNT |
| 封裝： | MO-178, SOT-23, 8 PIN |
| 文件頁數： | 2/9頁 |
| 文件大?。?/td> | 151K |
| 代理商： | MAX6627MKA-T |
M
Remote ±1°C Accurate Digital Temperature
Sensors with SPI-Compatible Serial Interface
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
All Voltages Referenced to GND
V
CC
...........................................................................-0.3V to +6V
SO, SCK, DXP,
CS
........................................-0.3V to V
CC
+ 0.3V
DXN.......................................................................-0.3V to +0.8V
SO Pin Current Range.........................................-1mA to +50mA
Current Into All Other Pins ..................................................10mA
ESD Protection (Human Body Model)................................2000V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Continuous Power Dissipation (T
A
= +70
°
C)
8-Pin SOT23 (derate 9.7mW/
°
C above +70
°
C)...........777mW
Operating Temperature Range .........................-55
°
C to +125
°
C
Junction Temperature......................................................+150
°
C
Storage Temperature Range.............................-65
°
C to +150
°
C
Lead Temperature (soldering, 10s)...................................Note 1
ELECTRICAL CHARACTERISTICS
(3.0V
≤
V
CC
≤
5.5V, -55
°
C
≤
T
A
≤
+125
°
C, unless otherwise noted. Typical values are at T
A
= +25
°
C, V
CC
= +3.3V, unless otherwise
noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
TEMPERATURE
0
°
C
≤
T
RJ
≤
+125
°
C, T
A
= +30
°
C,
V
CC
= +3.3V
-1.0
±
0.5
±
1
-55
°
C
≤
T
RJ
≤
+100
°
C, 0
°
C
≤
T
A
≤
+70
°
C,
V
CC
= +3.3V
-2.4
+2.4
-55
°
C
≤
T
RJ
≤
+145
°
C, 0
°
C
≤
T
A
≤
+70
°
C,
V
CC
= +3.3V
-4.5
+4.5
Accuracy
-55
°
C
≤
T
RJ
≤
+125
°
C, -55
°
C
≤
T
A
≤
+125
°
C,
V
CC
= +3.3V
-5.5
+5.5
°
C
Power-Supply Sensitivity
Resolution
0.25
0.0625
0.5
8
250
0.7
°
C/V
°
C
MAX6627
MAX6628
Ti m e Betw een C onver si on S ar s
t
SAMPLE
s
Conversion Time
POWER SUPPLY
Supply Voltage Range
t
CONV
180
320
ms
V
CC
I
SD
I
IDLE
I
CONV
3.0
5.5
5
20
600
400
50
V
Shutdown, V
CC
= +0.8V
ADC idle,
CS
= low
ADC converting
MAX6627
MAX6628
Supply Current, SCK Idle
360
200
30
μ
A
Average Operating Current
I
CC
μ
A
Power-On Reset (POR)
Threshold
V
CC
, falling edge
1.6
V
High level
Low level
80
8
100
10
120
12
Current Sourcing for Diode
μ
A
Note 1:
This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles
recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection
Reflow. Preheating is required. Hand or wave soldering is not allowed.
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