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參數(shù)資料
| 型號： | MAX6519UKN015+T |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 溫度/濕度傳感器 |
| 英文描述： | Low-Cost, 2.7V to 5.5V, Analog Temperature Sensor Switches in a SOT23 |
| 中文描述： | DIGITAL TEMP SENSOR-SINGLE TRIP POINT, 1.50Cel, RECTANGULAR, SURFACE MOUNT |
| 封裝： | MO-178-AA, SOT-23, 5 PIN |
| 文件頁數(shù)： | 20/22頁 |
| 文件大小： | 561K |
| 代理商： | MAX6519UKN015+T |
Calculate the temperature using the formula:
Verify that the temperature measured is within ±2°C
of the ambient board temperature. Measure the
ambient board temperature using an accurate cali-
brated temperature sensor.
Connect OUT to ground (OUT to VCC for cold
threshold versions) and observe the state change of
the logic output.
Disconnect OUT from ground and observe that the
logic output reverts to its initial state.
Hysteresis Testing
The MAX6516–MAX6519 can be programmed with 2°C
or 10°C of hysteresis by pin strapping HYST to VCC or
GND, respectively. Below is a test feature that can be
used to measure the accuracy of the device’s hystere-
sis using a device with a +65°C threshold:
Power up the device and observe the state of the
digital output.
Drive the OUT voltage down gradually.
When the digital output changes state, note VOUT.
VOUTtrip = VOUT at logic output change of state
(high to low or low to high).
Calculate trip temperature (T1) using:
Gradually raise VOUT until the digital output reverts to
its initial state and note VOUT.
Calculate trip temperature (T2).
THYST = T2 - T1.
Thermal Considerations
The MAX6516–MAX6519 supply current is typically 22A.
When used to drive high-impedance loads, the devices
dissipate negligible power. Therefore, the die tempera-
ture is essentially the same as the package temperature.
Accurate temperature monitoring depends on the thermal
resistance between the device being monitored and the
MAX6516–MAX6519 die. Heat flows in and out of plastic
packages, primarily through the leads. Pin 2 of the 5-pin
SOT23 package provides the lowest thermal resistance to
the die. Short, wide copper traces between the
MAX6516–MAX6519 and the object whose temperature
is being monitored ensures heat transfers occur quickly
and reliably. The rise in die temperature due to self-heat-
ing is given by the following formula:
TJ = PDISSIPATION θJA
where PDISSIPATION is the power dissipated by the
MAX6516–MAX6519, and
θJA is the thermal resistance
of the package.
The typical thermal resistance is +140°C/W for the
5-pin SOT23 package. To limit the effects of self-
heating, minimize the output current. For example, if the
MAX6516–MAX6519 sink 1mA, the open-drain output
voltage is guaranteed to be less than 0.3V. Therefore,
an additional 0.3mW of power is dissipated within the
IC. This corresponds to a 0.042°C shift in the die tem-
perature in the 5-pin SOT23 package.
Chip Information
TRANSISTOR COUNT: 1808
PROCESS: BiCMOS
T
VOUT
=+
1 8015
0 01062
30
.
T
VOUT
=+
1 8015
0 01062
30
.
MAX6516–MAX6519
Low-Cost, 2.7V to 5.5V, Analog Temperature
Sensor Switches in a SOT23
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| MAX6519UKN025+ | 制造商:Maxim Integrated Products 功能描述:TEMP SENSOR ANLG 5PIN SOT-23 - Rail/Tube |
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| MAX6519UKN035+ | 制造商:Maxim Integrated Products 功能描述:TEMP SENSOR ANLG 5PIN SOT-23 - Rail/Tube |
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