參數(shù)資料
型號(hào)： MAX6023
廠商： Maxim Integrated Products, Inc.
英文描述： 3.3-V ABT Octal Transparent D-type Latches With 3-State Outputs 20-CDIP -55 to 125
中文描述： 高精度、低功耗、低壓差、UCSP封裝電壓基準(zhǔn)
文件頁(yè)數(shù)： 2/13頁(yè)
文件大小： 279K
代理商： MAX6023
M
Precision, Low-Power, Low-Dropout, UCSP
Voltage Reference
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
(Voltages Referenced to GND)
IN.........................................................................-0.3V to +13.5V
OUT .............................................................-0.3V to (V
IN
+ 0.3V)
Output Short Circuit to GND or IN (V
IN
< 6V) ............Continuous
Output Short Circuit to GND or IN (V
IN
≥
6V) .........................60s
ELECTRICAL CHARACTERISTICS
–
MAX6023EBT12 (V
OUT
= 1.250V)
(V
IN
= +5V, I
OUT
= 0, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at T
A
= +25
°
C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Continuous Power Dissipation (T
A
= +70
°
C)
5-Bump UCSP (derate 3.4mW/
°
C above +70
°
C)........273mW
Operating Temperature Range ..........................-40
°
C to +85
°
C
Storage Temperature Range.............................-65
°
C to +150
°
C
Bump Temperature (soldering, 10s)................................+300
°
C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
OUTPUT
Output Voltage
Initial Voltage Accuracy
Output Voltage Temperature
Coefficient
V
OUT
T
A
= +25
°
C
T
A
= +25
°
C
1.247
-0.24
1.250
1.253
+0.24
V
%
(Note 3)
10
30
ppm/
°
C
Line Regulation
V
OUT
/
V
IN
2.5V
≤
V
IN
≤
12.6V
10
80
μV/V
0
≤
I
OUT
≤
400μA
-400μA
≤
I
OUT
≤
0
Short to GND
Short to IN
(Note 4)
0.4
0.5
4
10
90
1.0
1.1
Load Regulation
V
OUT
/
I
OUT
μV/μA
Short-Circuit Current
I
SC
mA
Temperature Hysteresis
ppm
ppm/
1000hr
Long-Term Stability
V
OUT
/
time
1000hr at T
A
= +25
°
C
30
DYNAMIC CHARACTERISTICS
f = 0.1Hz to 10Hz
f = 10Hz to 10kHz
25
65
μVp-p
μV
RMS
Noise Voltage
e
OUT
Ripple Rejection
V
OUT
/
I
OUT
V
IN
= +5V ±100mV, f = 120Hz
86
dB
Turn-On Settling Time
t
R
To V
OUT
within 0.1% of final value,
C
OUT
= 50pF
(Note 3)
30
μs
Capacitive-Load Stability Range
INPUT
Supply-Voltage Range
Supply Current
Change in Supply Current
C
OUT
0
2.2
nF
V
IN
I
IN
Guaranteed by line-regulation test
2.5
12.6
35
2.0
V
μA
μA/V
27
0.8
I
IN
/
V
IN
2.5V
≤
V
IN
≤
12.6V
Note 1:
This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
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