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參數(shù)資料
| 型號(hào)： | MAX5876EGK+D |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 12/19頁 |
| 文件大小： | 0K |
| 描述： | IC DAC 12BIT DUAL 250MSPS 68-QFN |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 30 |
| 設(shè)置時(shí)間： | 14ns |
| 位數(shù)： | 12 |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉(zhuǎn)換器數(shù)目： | 2 |
| 電壓電源： | 模擬和數(shù)字 |
| 功率耗散（最大）： | 331mW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 68-VFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 68-QFN 裸露焊盤（10x10） |
| 包裝： | 管件 |
| 輸出數(shù)目和類型： | 4 電流，單極 |
| 采樣率（每秒）： | 250M |
MAX5876
12-Bit, 250Msps, High-Dynamic-Performance,
Dual DAC with LVDS Inputs
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDD1.8, DVDD1.8 to GND, DACREF...................-0.3V to +2.16V
AVDD3.3, DVDD3.3, AVCLK to GND, DACREF ........-0.3V to +3.9V
REFIO, FSADJ to
GND, DACREF..................................-0.3V to (AVDD3.3 + 0.3V)
OUTIP, OUTIN, OUTQP,
OUTQN to GND, DACREF ...................-1V to (AVDD3.3 + 0.3V)
CLKP, CLKN to GND, DACREF..............-0.3V to (AVCLK + 0.3V)
B11P/B11N–B0P/B0N, XORN, XORP, SELIQN,
SELIQP to GND, DACREF ...................-0.3V to (DVDD1.8 + 0.3V)
TORB, PD to GND, DACREF ...............-0.3V to (DVDD3.3 + 0.3V)
Continuous Power Dissipation (TA = +70°C)
68-Pin QFN-EP
(derate 41.7mW/°C above +70°C) (Note 1) ............3333.3mW
Thermal Resistance
θJA (Note 1)...................................+24°C/W
Operating Temperature Range ......................... -40°C to +85°C
Junction Temperature .................................................... +150°C
Storage Temperature Range ........................... -60°C to +150°C
Lead Temperature (soldering, 10s) ............................... +300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
STATIC PERFORMANCE
Resolution
12
Bits
Integral Nonlinearity
INL
Measured differentially
±0.2
LSB
Differential Nonlinearity
DNL
Measured differentially
±0.1
LSB
Offset Error
OS
-0.025
±0.001 +0.025
%FS
Offset-Drift Tempco
±10
ppm/
°C
Full-Scale Gain Error
GEFS
External reference
-4.6
-0.6
+4.6
%FS
Internal reference
±100
Gain-Drift Tempco
External reference
±50
ppm/
°C
Full-Scale Output Current
IOUTFS
(Note 3)
2
20
mA
Output Compliance
Single-ended
-0.5
+1.1
V
Output Resistance
ROUT
1M
Output Capacitance
COUT
5pF
DYNAMIC PERFORMANCE
Clock Frequency
fCLK
2
500
MHz
Output Update Rate
fDAC
fDAC = fCLK / 2
1
250
Msps
fDAC = 150MHz
fOUT = 16MHz, -12dBFS
-154
Noise Spectral Density
fDAC = 250MHz
fOUT = 80MHz, -12dBFS
-153
dBFS/
Hz
ELECTRICAL CHARACTERISTICS
(AVDD3.3 = DVDD3.3 = AVCLK = +3.3V, AVDD1.8 = DVDD1.8 = +1.8V, GND = 0, fCLK = 2 x fDAC, external reference VREFIO = +1.25V, out-
put load 50
double-terminated, transformer-coupled output, IOUTFS = 20mA, TA = TMIN to TMAX, unless otherwise noted. Typical values
are at TA = +25°C.) (Note 2)
Note 1: Thermal resistance based on a multilayer board with 4 x 4 via array in exposed paddle area.
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