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參數(shù)資料
| 型號： | MAX4989ETD+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 2/8頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC CROSSPOINT SWITCH 14TDFN |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program Low Voltage Analog Switches Overview |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 功能： | 交叉點(diǎn)開關(guān) |
| 導(dǎo)通狀態(tài)電阻： | 5 歐姆 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 2.7 V ~ 5.5 V |
| 電流 - 電源： | 1µA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 14-WFDFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 14-TDFN-EP（3x3） |
| 包裝： | 標(biāo)準(zhǔn)包裝 |
| 其它名稱： | MAX4989ETD+TDKR |
MAX4989
USB 2.0 Hi-Speed 2-of-4 Crosspoint Switch
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = +2.7V to +5.5V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +3.3V, TA = +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
(Voltages referenced to GND.)
VCC ....................................................................... -0.3V to +6.0V
C_ ......................................................................... -0.3V to +6.0V
W_, X_, Y_, Z_ ........................................... -0.3V to (VCC + 0.3V)
Continuous Current C_ .................................................... ±30mA
Continuous Current W_, X_, Y_, Z_................................ ±120mA
Peak Current W_, X_, Y_, Z_
(pulsed at 1ms, 10% duty cycle) .............................. ±240mA
Continuous Power Dissipation (TA = +70°C)
14-Pin TDFN (derate 24.4mW/°C above +70°C) ..... 1951mW
Junction-to-Case Thermal Resistance (
ΘJC) (Note 1)
14-Pin TDFN ................................................................. 8°C/W
Junction-to-Ambient Thermal Resistance (
ΘJA) (Note 1)
14-Pin TDFN ............................................................... 41°C/W
Operating Temperature Range ......................... -40°C to +85°C
Junction Temperature .................................................... +150°C
Storage Temperature Range ........................... -65°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Operating Power-Supply Range
VCC
2.7
5.5
V
VCC = +3.3V
1
3.5
Supply Current
ICC
Switch enabled
VCC = +5.5V
3
6.5
A
Shutdown Supply Current
ISHDN
C1 = C2 = C3 = GND or VCC
0.1
0.5
A
Analog Signal Range
VW_, VX_,
VY_,VZ_
0VCC
V
On-Resistance
RON
VIN = +3.0V, IOUT = 10mA (Note 3)
5
9
Ω
On-Resistance Match Between
Channels
ΔRON
VCC = +3.3V, VIN = +1.5V,
IOUT = 10mA (Note 3)
0.5
Ω
On-Resistance Flatness
RFLAT
VCC = +3.3V, VIN = 0V to VCC,
IOUT = 10mA (Notes 3, 4, 5)
0.4
Ω
Off-Leakage Current
IIN(OFF)
VCC = +5.5V, VIN = 0V or VCC, VOUT = VCC
or 0V or unconnected (Note 3)
-1
+1
A
On-Leakage Current
IIN(ON)
VCC = +5.5V, VIN = 0V or VCC, VOUT =
unconnected (Note 3)
-1
+1
A
AC PERFORMANCE (Note 4)
On-Channel -3dB Bandwidth
BW
RL = RS = 50
Ω, VIN = 0dBm, Figure 1
1
GHz
Insertion Loss
S12
RL = RS = 50
Ω, f = 10MHz
0.5
dB
f = 10MHz, VIN = 0dBm, RL = RS = 50
Ω
-43
Off-Isolation (Note 3) Figure 1
VISO
f = 250MHz, VIN = 0dBm, RL = RS = 50
Ω
-15
dB
Crosstalk
VCT
f = 50MHz, VIN = 0dBm, RL = RS = 50
Ω,
between adjacent pairs (Note 3), Figure 1
-50
dB
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