參數(shù)資料
型號(hào): MAX4969CTO+
廠商: Maxim Integrated Products
文件頁(yè)數(shù): 2/10頁(yè)
文件大?。?/td> 0K
描述: IC MUX/REDRIVER PCIE 42TQFN
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 28
類(lèi)型: 轉(zhuǎn)接驅(qū)動(dòng)器
驅(qū)動(dòng)器/接收器數(shù): 1/1
規(guī)程: PCIe?
電源電壓: 3 V ~ 3.6 V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 42-WFQFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 42-TQFN-EP(3.5x9)
包裝: 管件
PCIe, Single Lane, 2:1/1:2 Multiplexer and
Redriver with Equalization
MAX4969
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time.
10
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
2009 Maxim Integrated Products
Maxim is a registered trademark of Maxim Integrated Products, Inc.
Applications Information
Layout
Circuit board layout and design can significantly affect
the performance of the MAX4969. Use good high-fre-
quency design techniques, including minimizing ground
inductance and using controlled-impedance transmis-
sion lines on data signals. It is recommended to run
receive and transmit on different layers to minimize
crosstalk and to place 1FF and 0.01FF power-supply
bypass capacitors in parallel as close to VCC as possible
on each VCC pin. Always connect VCC to a power plane.
Exposed Pad Package
The exposed-pad, 42-pin TQFN package incorporates
features that provide a very low thermal resistance path
for heat removal from the IC. The exposed pad on the
MAX4969 must be soldered to the circuit board ground
plane for proper thermal performance. For more informa-
tion on exposed-pad packages, refer to Application Note
862: HFAN-08.1: Thermal Considerations of QFN and
Other Exposed-Paddle Packages.
Power-Supply Sequencing
Caution: Do not exceed the absolute maximum rat-
ings because stresses beyond the listed ratings may
cause permanent damage to the device.
Proper power-supply sequencing is recommended for
all devices. Always apply GND then VCC before apply-
ing signals, especially if the signal is not current limited.
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land pat-
terns, go to www.maxim-ic.com/packages. Note that
a “+”, “#”, or “-” in the package code indicates RoHS
status only. Package drawings may show a different suf-
fix character, but the drawing pertains to the package
regardless of RoHS status.
Typical Application Circuit
MAX4969
IN
OUT
Tx
OUTA
OUTB
INA
INB
Rx
PCIe
HOST
Rx
Tx
PCIe
DEVICE B
Rx
Tx
PCIe
DEVICE A
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
42 TQFN-EP
T423590+1
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參數(shù)描述
MAX4969CTO+ 功能描述:多路器開(kāi)關(guān) IC PCIe MUX w/Re-Drive RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開(kāi)關(guān)數(shù)量:4 開(kāi)啟電阻(最大值):7 Ohms 開(kāi)啟時(shí)間(最大值): 關(guān)閉時(shí)間(最大值): 傳播延遲時(shí)間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UQFN-16
MAX4969CTO+T 功能描述:多路器開(kāi)關(guān) IC PCIe MUX w/Re-Drive RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開(kāi)關(guān)數(shù)量:4 開(kāi)啟電阻(最大值):7 Ohms 開(kāi)啟時(shí)間(最大值): 關(guān)閉時(shí)間(最大值): 傳播延遲時(shí)間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UQFN-16
MAX496C/D 功能描述:運(yùn)算放大器 - 運(yùn)放 RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比(最小值):63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流(最大值):10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
MAX496CPE 功能描述:運(yùn)算放大器 - 運(yùn)放 RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比(最小值):63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流(最大值):10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel
MAX496CPE+ 功能描述:運(yùn)算放大器 - 運(yùn)放 RoHS:否 制造商:STMicroelectronics 通道數(shù)量:4 共模抑制比(最小值):63 dB 輸入補(bǔ)償電壓:1 mV 輸入偏流(最大值):10 pA 工作電源電壓:2.7 V to 5.5 V 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 轉(zhuǎn)換速度:0.89 V/us 關(guān)閉:No 輸出電流:55 mA 最大工作溫度:+ 125 C 封裝:Reel