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2 ______________________________________________________________________________________
MAX4936–MAX4939
Octal High-Voltage Transmit/Receive Switches
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(All voltages referenced to GND, unless otherwise noted.)
VDD Positive Supply Voltage...................................-0.3V to +6V
VCC, LVCC_ Positive Supply Voltage ....................-0.3V to +6V
VEE, LVEE_ Negative Supply Voltage ....................-6V to +0.3V
CLK, DIN, CLR, LE Input Voltage ..........................-0.3V to +6V
DOUT Output Voltage ..............................-0.3V to (VDD + 0.3V)
HV_ Input Voltage (MAX4936/MAX4938) ..........-120V to +120V
COM_ Input/Output Voltage...............................-120V to +120V
NO_ Output Voltage (MAX4936/MAX4937) ...................... Q1.5V
NO_ Output Voltage (MAX4938/MAX4939) ......................... Q6V
Voltage Difference Across Any or
All HV_ (MAX4936/MAX4938) ...................................... Q230V
Voltage Difference Across Any or All COM_ .................. Q230V
Continuous Current (HV_ to COM_ ) (MAX4936/MAX4938)..Q250mA
Continuous Current (Any Other Terminal)..................... Q100mA
Peak Current (HV_ to COM_ ) (MAX4936/MAX4938)
(Pulsed at 1ms, 0.1% Duty Cycle) ................................ Q2.5A
Continuous Power Dissipation (TA = +70NC)
TQFN (derate 41.0mW/NC above +70NC) .................3279mW
Operating Temperature Range............................. 0NC to +70NC
Storage Temperature Range............................ -65NC to +150NC
Junction Temperature ................................................... +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(VDD = +1.62V to +5.5V, VCC = +2.7V to +5.5V, VEE = -2.7V to -5.5V, VCLR = 0V, LVCC_ = VCC, LVEE_ = VEE, TA = TMIN to TMAX,
unless otherwise noted. Typical values are at TA = +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistance were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (
qJA)...........44°C/W
Junction-to-Case Thermal Resistance (
qJC).................10°C/W
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
STATIC CHARACTERISTICS
HV_ Input Voltage Range
VIRHV_
MAX4936/MAX4938 only
-115
+115
V
|Difference Across Any or All
HV_ |
MAX4936/MAX4938 only
220
V
COM_ Output Voltage Range
VORCM_
|VHV_| R +2V, IHV_ = Q100mA (MAX4936/
MAX4938 only)
VHV_
- 1
VHV_ Q
0.85
VHV_
+ 1
V
COM_ Input Voltage Range
VIRCM_
-115
+115
V
|Difference Across Any or All
COM_ |
220
V
NO_ Output Voltage Range
VORNO_
VCC = +5V, VEE = -5V, |VCOM_| R +2V,
RL = 200I, CL = 30pF, ICH_ = 10mA
(MAX4936/MAX4937 only)
-1
Q
0.75
+1
V
VCC = +5V, VEE = -5V, |VCOM_| < +0.4V,
RL = 200I, CL = 30pF, ICH_ = 1.5mA
VCOM_
- 0.2
VCOM_
Q
0.1
VCOM_
+ 0.2
HV_ to COM_ Continuous
Current
ICN_
VCOM_ = 0V (MAX4936/MAX4938 only)
-200
+200
mA
HV_ to COM_ Drop
VCN_
VCOM_ = 0V, ICN_ = Q2A
(MAX4936/MAX4938 only)
Q
2
V
Diode Bridge Voltage Offset
VOFF_
VCC = +5V, VEE = -5V, COM_ = unconnected,
NO_ = unconnected, ICH = 1.5mA
-200
+200
mV