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參數(shù)資料
| 型號： | MAX4893BETB+T |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 3/13頁 |
| 文件大小： | 0K |
| 描述： | IC CTLR OVP CURR LIMIT 10-TDFN |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 類型： | 過壓保護(hù)控制器 |
| 應(yīng)用： | 手機(jī)，數(shù)碼相機(jī)，媒體播放器 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 10-WFDFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 10-TDFN-EP（3x3） |
| 包裝： | 帶卷 (TR) |
ground-connected pad as the only electrical ground
connection or ground return. Use GND (pin 6) as the
only electrical ground connection.
ESD Test Conditions
ESD performance depends on a number of conditions.
The MAX4881–MAX4884/MAX4893B is specified for
15kV typical ESD resistance on IN when IN is bypassed
to ground with a 1F low-ESR ceramic capacitor.
Contact Maxim for a reliability report that documents
test setup, methodology, and results.
Human Body Model
Figure 8 shows the Human Body Model and Figure 9
shows the current waveform it generates when dis-
charged into a low impedance. This model consists of
a 100pF capacitor charged to the ESD voltage of inter-
est, which is then discharged into the device through a
1.5k
resistor.
IEC 61000-4-2
Since January 1996, all equipment manufactured
and/or sold in the European community has been
required to meet the stringent IEC 61000-4-2 specifica-
tion. The IEC 61000-4-2 standard covers ESD testing
and performance of finished equipment; it does not
specifically refer to integrated circuits. The
MAX4881–MAX4884/MAX4893B help users design
equipment that meets Level 3 of IEC 61000-4-2, without
additional ESD-protection components.
The main difference between tests done using the
Human Body Model and IEC 61000-4-2 is higher peak
current in IEC 61000-4-2. Because series resistance is
lower in the IEC 61000-4-2 ESD test model (Figure 10),
the ESD-withstand voltage measured to this standard is
generally lower than that measured using the Human
Body Model. Figure 11 shows the current waveform for
the ±8kV, IEC 61000-4-2, Level 4, ESD Contact
Discharge test. The Air-Gap test involves approaching
the device with a charger probe. The Contact
Discharge method connects the probe to the device
before the probe is energized.
Typical Operating Circuits
Figures 12 and 13 depict some typical connections to
the MAX4881–MAX4884/MAX4893B. Figure 12 shows a
battery charger application where the source power is
an 4.4V adapter with a built-in charger, while Figure 13
shows an application where the battery charger is
external.
Chip Information
TRANSISTOR COUNT: 2391
PROCESS: BiCMOS
MAX4881–MAX4884/MAX4893B
Overvoltage Protection Controllers with
Current Limit in TDFN
______________________________________________________________________________________
11
AC-DC
ADAPTER
5.25V
GATE
IN
FLAGI
OV
Li+
BTB
BTA
1.1A/0.9A/0.7A
CB
EN
GND
LOAD
VIO
MAX4881/
MAX4883/
MAX4893B
BATTERY
CHARGER
Figure 13. Connection to an AC-DC Adapter with a Built-In
Battery Charger
4.4V ADAPTER
WITH BUILT-IN
CHARGER
GATE
IN
FLAGI
OV
Li+
BTB
BTA
1.1A/0.7A
CB
EN
GND
LOAD
VIO
MAX4882/
MAX4884
Figure 12. Connection to an AC-DC Adapter without a Built-In
Battery Charger
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