M
0.5
, Quad S PDT S witc hes in UCS P/QFN
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
(All Voltages Referenced to GND)
V+, IN_,
EN
...............................................................-0.3V to +6V
COM_, NO_, NC_ (Note 1) ...........................-0.3V to (V+ + 0.3V)
Continuous Current
NC1, NC2, COM1, COM2 (MAX4755)........................±100mA
NO_, NC_, COM_ (remaining terminal connections) ....±300mA
Peak Current NC1, NC2, COM1, COM2 (MAX4755)
(Pulsed at 1ms, 10% duty cycle)................................±200mA
(Pulsed at 1ms, 50% duty cycle)................................±150mA
Peak Current NO_, NC_,
COM__ (remaining terminal connections)
(Pulsed at 1ms, 10% duty cycle)............................±500mA
(Pulsed at 1ms, 50% duty cycle)............................±400mA
ELECTRICAL CHARACTERISTICS
(V+ = +2.7V to +5.25V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at +3V and T
A
= +25°C.) (Notes 2, 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Continuous Power Dissipation (T
A
= +70°C)
16-Bump UCSP (derate 8.2mW/°C above +70°C) ......660mW
16-Pin Thin QFN (derate 16.9mW/°C above +70°C) .1349mW
ESD per Method 3015.7...................................................±2kV
Operating Temperature Range ...........................-40°C to +85°C
J unction Temperature......................................................+150°C
Storage Temperature Range.............................-65°C to +150°C
Bump Temperature (soldering)
Infrared (15s) ...............................................................+220°C
Vapor Phase (60s) .......................................................+215°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1:
Signals on NO_, NC_, COM_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maximum
current rating.
PARAMETER
ANALOG SWITCH
SYMBOL
CONDITIONS
T
A
MIN
TYP
MAX
UNITS
Analog Signal Range
V
COM_
,
V
NO_,
V
NC_
T
MIN
to
T
MAX
0
V+
V
+25°C
0.5
0.85
MAX4755
(NO1, NO2, N_3, N_4),
MAX4754/MAX4756
T
MIN
to
T
MAX
+25°C
1.0
11.5
On-Resistance
R
ON
V+ = 2.7V,
I
COM_
= 10mA,
V
NC
_ =
0V, or
V
NC
_ = V+
(Note 4)
MAX4755 (NC1, NC2)
T
MIN
to
T
MAX
+25°C
8.0
12.5
0.1
0.35
MAX4755
(NO1, NO2, N_3, N_4)
MAX4754/MAX4756
T
MIN
to
T
MAX
+25°C
0.55
0.2
0.4
On-Resistance Match
Between Channels
R
ON
V+ = 2.7V,
I
COM
_ = 10mA,
V
NO
_ = 1.5V, or
V
NC
_ = 1.5V
(Notes 4, 5)
MAX4755 (NC1, NC2)
T
MIN
to
T
MAX
+25°C
0.55
0.2
0.4
On-Resistance Flatness
R
FLAT(ON)
V+ = 3V,
I
COM_
= 10mA,
V
NO_
= 0V, or
V
NC_
= V+
(Note 6)
MAX4755
(NO1, NO2, N_3, N_4,
NO1, NO2),
MAX4754/MAX4756
T
MIN
to
T
MAX
0.55
+25°C
-3
+3
NO_, NC_ Off-Leakage
Current
I
NO_(OFF),
I
NC_(OFF)
V+ = 3.6V;
V
COM_
= 3.3V, 0.3V;
V
NO_
or V
NC_
= 0.3V, 3.3V
T
MIN
to
T
MAX
+25°C
-10
+10
nA
-3
±
0.01
+3
COM_ Off-Leakage
Current
I
COM_(OFF)
V+ = 3.6V (MAX4756);
V
COM_
= 3.3V, 0.3V;
V
NO_
or V
NC_
= 0.3V, 3.3V
T
MIN
to
T
MAX
-10
+10
nA