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參數(shù)資料
| 型號： | MAX4719EUB |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 運(yùn)動控制電子 |
| 英文描述： | 300MHz Bandwidth, Dual SPDT Analog Switch in UCSP |
| 中文描述： | DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO10 |
| 封裝： | MICRO MAX PACKAGE-10 |
| 文件頁數(shù)： | 8/11頁 |
| 文件大小： | 282K |
| 代理商： | MAX4719EUB |
Test Circuits/Timing Diagrams
tr < 5ns
tf < 5ns
50%
V
IL
LOGIC
INPUT
R
L
300
COM_
GND
IN_
C
L
INCLUDES FIXTURE AND STRAY CAPACITANCE.
OUT
= V
N_
(
R
L
)
V
L
+ R
ON
V
N_
V
IH
t
OFF
0V
NO_
OR NC_
0.9 x V
0UT
0.9 x V
OUT
t
ON
V
OUT
SWITCH
OUTPUT
LOGIC
INPUT
LOGIC INPUT WAVEFORMS INVERTED FOR SWITCHES
THAT HAVE THE OPPOSITE LOGIC SENSE.
V+
C
35pF
V+
V
OUT
MAX4719
Figure 1. Switching Time
50%
V
IH
V
IL
LOGIC
INPUT
V
OUT
0.9 x V
OUT
t
BBM
LOGIC
INPUT
R
L
300
GND
C
L
INCLUDES FIXTURE AND STRAY CAPACITANCE.
NO_
IN_
NC_
V
OUT
V+
V+
C
35pF
V
N_
COM_
MAX4719
Figure 2. Break-Before-Make Interval
M
Power-Supply Sequencing and
Overvoltage Protection
Caution: Do not exceed the absolute maximum rat-
ings because stresses beyond the listed ratings
may cause permanent damage to the device.
Proper power-supply sequencing is recommended for
all CMOS devices. Always apply V+ before applying
analog signals, especially if the analog signal is not
current-limited.
UCSP Package Considerations
For general UCSP package information and PC layout
considerations, please refer to the Maxim Application
Note (Wafer-Level Chip-Scale Package).
UCSP Reliability
The chip-scale package (UCSP) represents a unique
packaging form factor that may not perform equally to a
packaged product through traditional mechanical relia-
bility tests. UCSP reliability is integrally linked to the
user
’
s assembly methods, circuit board material, and
usage environment. The user should closely review
these areas when considering use of a UCSP package.
Performance through Operating Life Test and Moisture
Resistance remains uncompromised as it is primarily
determined by the wafer-fabrication process.
Mechanical stress performance is a greater considera-
tion for a UCSP package. UCSPs are attached through
direct solder contact to the user
’
s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be consid-
ered. Information on Maxim
’
s qualification plan, test
data, and recommendations are detailed in the UCSP
application note, which can be found on Maxim
’
s web-
site at www.maxim-ic.com.
Chip Information
TRANSISTOR COUNT: 235
PROCESS: BiCMOS
20
, 300MHz Bandwidth, Dual SPDT Analog
Switch in UCSP
8
_______________________________________________________________________________________
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX4719EUB+ | 功能描述:模擬開關(guān) IC 20Ohm 300MHz SPDT Analog Switch RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時間（最大值）: 關(guān)閉時間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| MAX4719EUB+T | 功能描述:模擬開關(guān) IC 20Ohm 300MHz SPDT Analog Switch RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時間（最大值）: 關(guān)閉時間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| MAX4719EUB-T | 功能描述:模擬開關(guān) IC RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時間（最大值）: 關(guān)閉時間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| MAX471CPA | 功能描述:特殊用途放大器 RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel |
| MAX471CSA | 功能描述:特殊用途放大器 RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel |
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