
M
2.5
, Low-Voltage, SPST/SPDT
Analog Switches in UCSP Package
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
All Voltages Referenced to GND
V+, IN .......................................................................-0.3V to +6V
COM, NO, NC (Note1)..................................-0.3V to (V+ + 0.3V)
Continuous Current NO, NC, COM ................................±100mA
Peak Current NO, NC, COM
(pulsed at 1ms, 10% duty cycle) ...............................±200mA
Note 1:
Signals on NO, NC, and COM exceeding V+ are clamped by an internal diode. Limit forward-diode current to maximum cur-
rent rating.
Note 2:
This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is requied. Hand or wave soldering is not allowed.
ELECTRICAL CHARACTERISTICS
(V+ = +2.7V to +3.3V, V
IH
= +1.4V, V
IL
= 0.5V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at 3V and T
A
= +25
°
C.)
(Notes 3, 4)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Continuous Power Dissipation (T
A
= +70
°
C)
3 x 2 UCSP (derate 10.1mW/
°
C at +70
°
C) ..................808mW
Operating Temperature Range ...........................-40
°
C to +85
°
C
Storage Temperature Range ............................-65
°
C to +150
°
C
Bump Reflow Temperature .............................................+235
°
C
PARAMETER
ANALOG SWITCH
SYMBOL
CONDITIONS
T
A
MIN
TYP
MAX
U N T S
Analog Signal Range
V
COM
, V
NO
,
V
NC
T
MIN
to
T
MAX
+25
°
C
0
V+
V
1.5
2.5
On-Resistance
R
ON
V+ = 2.7V, V
NC
= 0 to V+,
I
COM
= 10mA
T
MIN
to
T
MAX
3.5
+25
°
C
0.3
0.4
On-Resistance Match
Between Channels
(MAX4688 only)
(Note 5)
R
ON
V+ = 2.7V, V
NO
or V
NC
= 1.5V,
I
COM
= 10mA
T
MIN
to
T
MAX
0.5
+25
°
C
0.5
1
On-Resistance Flatness
(Note 6)
R
FLAT(ON)
V+ = 2.7V, V
NO
or V
NC
= 0 to V+,
I
COM
= 10mA
T
MIN
to
T
MAX
+25
°
C
1
-0.5
±
0.01
+0.5
NO, NC Off-Leakage
Current (Note 7)
I
NO(OFF)
,
I
NC(OFF)
V+ = 3.3V; V
COM
= 0.3V or 3V;
V
NO
or V
NC
= 3V, 0.3V
T
MIN
to
T
MAX
+25
°
C
-1
1
nA
-0.5
±
0.01
0.5
COM Off-Leakage
Current (Note 7)
I
COM_(OFF)
V+ = 3.3V; V
COM
= 0.3V or 3V;
V
NO
or V
NC
= 3V, 0.3V
T
MIN
to
T
MAX
+25
°
C
-1
1
nA
-0.5
±
0.01
0.5
COM On-Leakage
Current (Note 7)
I
COM_(ON)
V+ = 3.3V; V
COM
= 3V or 0.3V;
V
NO
or V
NC
= 3V, 0.3V, or floating
T
MIN
to
T
MAX
-1
1
nA
DYNAMIC CHARACTERISTICS
+25
°
C
20
30
Turn-On Time (Note 7)
t
ON
V
NO
or V
NC
= 1.5V, Figure 2
T
MIN
to
T
MAX
35
ns