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參數(shù)資料
型號: MAX44260AXT+T
廠商: Maxim Integrated Products
文件頁數(shù): 7/14頁
文件大?。?/td> 0K
描述: IC OP AMP R-R SGL 6-SC70
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 1
放大器類型: 通用
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 1.3 V/µs
增益帶寬積: 15MHz
電流 - 輸入偏壓: 5pA
電流 - 電源: 750µA
電壓 - 電源,單路/雙路(±): 1.7 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 6-TSSOP,SC-88,SOT-363
供應(yīng)商設(shè)備封裝: SC-70-6
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: MAX44260AXT+TDKR
2
Maxim Integrated
MAX44260/MAX44261/MAX44263
1.8V, 15MHz Low-Offset,
Low-Power, Rail-to-Rail I/O Op Amps
IN+, IN-, OUT .................................(VSS - 0.3V) to (VDD + 0.3V)
VDD to VSS...............................................................-0.3V to +6V
SHDN, CAL .............................................................-0.3V to +6V
Output to Short-Circuit Ground Duration .............................. 10s
Continuous Input Current into Any Pin............................ Q20mA
Continuous Power Dissipation (TA = +70NC)
SC70 (derate 3.1mW/NC above +70NC) ......................245mW
6-Pin Thin DFN (Ultra-Thin LGA)
(derate 2.1mW/NC above +70NC) .............................110.2mW
Operating Temperature Range........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
SC70
Junction-to-Ambient Thermal Resistance (BJA) .... 326.5NC/W
Junction-to-Case Thermal Resistance (BJC) .............115NC/W
Thin DFN (Ultra-Thin LGA)
Junction-to-Ambient Thermal Resistance (BJA) ....... 470NC/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(VDD = 3.3V, VSS = 0V, VIN+ = VIN- = VDD/2, RL = 10kI to VDD/2, VCAL = VSHDN = VDD, TA = -40NC to +125NC. Typical values are
at TA = +25NC, unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Input Voltage Range
VIN+ VIN-
Guaranteed by CMRR test
-0.1
VDD
+ 0.1
V
Input Offset Voltage (Note 3)
VOS
TA = +25NC
10
50
F
V
TA = -40°C to +125°C after calibration
100
TA = -40°C to
+125
°C
MAX44260/MAX44261
500
MAX44263
800
Input Offset Voltage Drift
(Note 3)
VOS - TC
MAX44260/MAX44261
0.8
5
F
V/NC
MAX44263
1
8
Input Bias Current (Note 3)
IB
TA = +25NC
MAX44260/MAX44261
0.01
0.5
pA
MAX44263
0.01
0.5
TA = -40NC to +85NC
10
TA = -40NC to
+125NC
MAX44260/MAX44261
100
MAX44263
160
Input Capacitance
CIN
0.4
pF
Common-Mode Rejection Ratio
CMRR
VCM = -0.1V to (VDD + 0.1V)
75
90
dB
Open-Loop Gain
AOL
0.4V P VOUT
P
VDD - 0.4V,
ROUT = 10kI
MAX44260/MAX44261
100
115
dB
MAX44263
97
115
0.4V P VOUT
P
VDD - 0.4V,
ROUT = 600I
MAX44260/MAX44261
91
100
MAX44263
86
100
0.4V P VOUT P VDD - 0.4V, ROUT = 32I
80
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