參數(shù)資料
型號: MAX4365ETA+T
廠商: Maxim Integrated Products
文件頁數(shù): 7/14頁
文件大?。?/td> 0K
描述: IC AMP AUDIO PWR 1W MONO 8TDFN
標準包裝: 2,500
類型: AB 類
輸出類型: 1-通道(單聲道)
在某負載時最大輸出功率 x 通道數(shù)量: 1W x 1 @ 8 歐姆
電源電壓: 2.7 V ~ 5.5 V
特點: 消除爆音,短路保護和熱保護,關閉
安裝類型: 表面貼裝
供應商設備封裝: 8-TDFN-EP(3x3)
封裝/外殼: 8-WDFN 裸露焊盤
包裝: 帶卷 (TR)
MAX4364/MAX4365
1.4W and 1W, Ultra-Small, Audio Power
Amplifiers with Shutdown
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC, OUT_ to GND...................................................-0.3V to +6V
IN+, IN-, BIAS, SHDN to GND....................-0.3V to (VCC + 0.3V)
Output Short Circuit (OUT+ to OUT-) (Note 1)...........Continuous
Continuous Power Dissipation (TA = +70°C)
8-Pin MAX (derate 4.8mW/°C above +70°C) ..............388mW
8-Pin TDFN (derate 24.4mW/°C above +70°C) ..........1951mW
8-Pin SO (derate 7.8mW/°C above +70°C)...................623mW
Junction Temperature ......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
ELECTRICAL CHARACTERISTICS—5V
(VCC = 5V, RL = ∞, CBIAS = 1F to GND, VSHDN = VGND, TA = +25°C, unless otherwise noted.) (Note 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage Range
VCC
Inferred from PSRR test
2.7
5.5
V
MAX4364
7
13
MAX4364, TA = TMIN to TMAX
17
MAX4365
5
8
Supply Current
ICC
(Note 4)
MAX4365, TA = TMIN to TMAX
11
mA
Shutdown Supply Current
ISHDN
VSHDN = VCC
0.01
4
A
TA = +25°C
VCC x
0.7
VIH
TA = -40°C to +85°C
(Note 5)
VCC x
0.7
TA = +25°C
VCC x
0.3
SHDN Threshold
VIL
TA = -40°C to +85°C
(Note 5)
VCC x
0.3
V
Common-Mode Bias Voltage
VBIAS
(Note 6)
VCC/2 -
5%
VCC/2
+ 5%
V
Output Offset Voltage
VOS
IN- = OUT+, IN+ = BIAS (Note 7)
±1
±10
mV
VCC = 2.7V to 5.5V
DC
55
75
217Hz
68
Power-Supply Rejection Ratio
PSRR
VRIPPLE = 200mVP-P,
RL = 8
1kHz
58
dB
MAX4364
1200
1400
Output Power
POUT
RL = 8
, THD+N = 1%,
fIN = 1kHz (Note 8)
MAX4365
800
1000
mW
Note 1: Continuous power dissipation must also be observed.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
MAX
Junction-to-Ambient Thermal Resistance (
θJA)......206.3°C/W
Junction-to-Case Thermal Resistance (
θJC)................42°C/W
TDFN
Junction-to-Ambient Thermal Resistance (
θJA)...........41°C/W
Junction-to-Case Thermal Resistance (
θJC)..................8°C/W
SO
Junction-to-Ambient Thermal Resistance (
θJA)......128.4°C/W
Junction-to-Case Thermal Resistance (
θJC)................36°C/W
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