
MAX4322/MAX4323/MAX4326/MAX4327/MAX4329
Single/Dual/Quad, Low-Cost, UCSP/SOT23,
Low-Power, Rail-to-Rail I/O Op Amps
______________________________________________________________________________________
13
TOP VIEW
VEE
IN-
IN+
1
5
VCC
OUT
MAX4322
SOT23-5
2
3
4
IN2-
IN1+
IN2+
VEE
1
2
8
7
VCC
OUT2
IN1-
OUT1
MAX4326
SO/
MAX
3
4
6
5
OUT
IN1+
N.C.
VEE
1
2
8
7
N.C.
VCC
IN1-
N.C.
MAX4322
SO/
MAX
3
4
6
5
14
13
12
11
10
9
8
1
2
3
4
5
6
7
OUT4
IN4-
IN4+
VEE
VCC
IN1+
IN1-
OUT1
MAX4329
IN3+
IN3-
OUT3
OUT2
IN2-
IN2+
SO
14
13
12
11
10
9
8
1
2
3
4
5
6
7
VCC
OUT2
IN2-
IN2+
VEE
IN1+
IN1-
OUT1
MAX4327
N.C.
SHDN2
N.C.
SHDN1
N.C.
SO
OUT
IN1+
N.C.
VEE
1
2
8
7
SHDN
VCC
IN1-
N.C.
MAX4323
SO/
MAX
3
4
6
5
1
2
3
4
5
10
9
8
7
6
VCC
OUT2
IN2-
IN2+
VEE
IN1+
IN1-
OUT1
MAX4327
MAX
SHDN2
SHDN1
VEE
IN-
IN+
1
6
VCC
OUT
MAX4323
SOT23
2
3
4
SHDN
5
Pin Configurations (continued)
Ordering Information (continued)
PART
TEMP
RANGE
PIN/BUMP-
PACKAGE
TOP
MARK
MAX4323EBT-T* -40
oC to +85oC
6 UCSP-6
AAW
MAX4323EUT-T
-40
oC to +85oC
6 SOT23-6
AAEC
MAX4323EUA
-40
oC to +85oC
8 MAX
—
MAX4323ESA
-40
oC to +85oC
8 SO
—
MAX4326EUA
-40
oC to +85oC
8 MAX
—
MAX4326ESA
-40
oC to +85oC
8 SO
—
MAX4327EUB
-40
oC to +85oC
10 MAX
—
MAX4327ESD
-40
oC to +85oC
14 SO
—
MAX4329ESD
-40
oC to +85oC
14 SO
—
UCSP Reliability
The UCSP represents a unique packaging form factor
that may not perform as well as a packaged product
through traditional mechanical reliability tests. UCSP
reliability is integrally linked to the user's assembly
methods, circuit board material, and usage environ-
ment. The user should closely review these areas when
considering use of a UCSP.
Performance through operating-life test and moisture
resistance remains uncompromised. The wafer-fabrica-
tion process primarily determines the performance.
Mechanical stress performance is a greater considera-
tion for UCSPs. UCSPs are attached through direct sol-
der contact to the user's PC board, foregoing the
inherent stress relief of a packaged product lead frame.
Solder-joint contact integrity must be considered.
Comprehensive reliability tests have been performed
and are available upon request. In conclusion, the
UCSP performs reliably through environmental stresses.
*UCSP reliability is integrally linked to the user’s assembly
methods, circuit board material, and environment. See the
UCSP Reliability Notice in the UCSP Reliability section of this
data sheet for more information.