
M
High-Output-Drive, 10MHz, 10V/μs,
Rail-to-Rail I/O Op Amps with Shutdown in SC70
______________________________________________________________________________________
17
S
REV.
D
DOCUMENT CONTROL NO.
21-0078
APPROVAL
PROPRIETARY INFORMATION
TITLE:
PACKAGE OUTLINE, SOT-23, 8L BODY
3.00
1.75
2.60
1.50
E
E1
C
E1
E
BETWEEN 0.08mm AND 0.15mm FROM LEAD TIP.
8. MEETS JEDEC MO178.
8∞
0.60
0.30
L2
e
0∞
e1
0
L
0.65 BSC.
1.95 REF.
0.25 BSC.
GAUGE PLANE
SEATING PLANE C
C
L
PIN 1
I.D. DOT
(SEE NOTE 6)
L
C
L
C
A2
e1
D
DETAIL "A"
5. COPLANARITY 4 MILS. MAX.
6. PIN 1 I.D. DOT IS 0.3 MM MIN. LOCATED ABOVE PIN 1.
NOTE:
7. SOLDER THICKNESS MEASURED AT FLAT SECTION OF LEAD
4. PACKAGE OUTLINE INCLUSIVE OF SOLDER PLATING.
3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH & METAL BURR.
HEEL OF THE LEAD PARALLEL TO SEATING PLANE C.
2. FOOT LENGTH MEASURED FROM LEAD TIP TO UPPER RADIUS OF
1. ALL DIMENSIONS ARE IN MILLIMETERS.
L2
L
A1
A
0.45
0.20
1.30
0.15
1.45
MAX
0.28
0.09
b
C
0.90
A2
0.00
A1
0.90
A
MIN
SYMBOL
3.00
2.80
D
SEE DETAIL "A"
L
C
b
e
1
1
0
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to
www.maxim-ic.com/packages
.)