MAX4180–MAX4187
Single/Dual/Quad, 270MHz, 1mA, SOT23,
Current-Feedback Amplifiers with Shutdown
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Keep lines as short and as straight as possible.
Do not make 90° turns; round all corners.
Observe high-frequency bypassing techniques to
maintain the amplifiers’ accuracy. The bypass cap-
acitors should include a 0.01F to 0.1F ceramic
capacitor between each supply pin and the ground
plane, located as close to the package as possible.
Place a 1F ceramic capacitor in parallel with each
0.01F to 0.1F capacitor as close to them as
possible.
Place a 10F to 15F low-ESR tantalum at the point
of entry to the power-supply pins’ PC board. The
power-supply trace should lead directly from the
tantalum capacitor to the VCC and VEE pins.
Keep PC traces short and use surface-mount com-
ponents to minimize parasitic inductance.
Maxim’s High-Speed Evaluation Board
Figures 2 and 3 show layouts of Maxim’s high-speed
single SOT23 and SO evaluation boards. These boards
were developed using the techniques described above.
The smallest available surface-mount resistors were
used for feedback and back-termination to minimize
their distance from the part, reducing the capacitance
associated with longer lead lengths.
SMA connectors were used for best high-frequency
performance. Because distances are extremely short,
performance is unaffected by the fact that inputs and
outputs do not match a 50
line. However, in applica-
tions that require lead lengths greater than one-quarter
of the wavelength of the highest frequency of interest,
use constant-impedance traces.
Fully assembled evaluation boards are available for the
MAX4180ESA.
Figure 2a. SOT23 High-Speed EV Board
Component Placement Guide—
Component Side
Figure 2b. SOT23 High-Speed EV Board
Layout—Component Side
Figure 2c. High-Speed EV Board Layout—
Solder Side
Figure 3a. SO-8 High-Speed EV Board
Component Placement Guide—
Component Side
Figure 3b. SO-8 High-Speed EV Board
Layout—Component Side
Figure 3c. SO-8 High-Speed EV Board
Layout—Solder Side
