
M
_______________Detailed Desc ription
The MAX4100/MAX4101 are low-power, high-bandwidth
operational amplifiers optimized for driving back-termi-
nated cables in composite video, RGB, and RF systems.
The MAX4100 is unity-gain stable, and the MAX4101 is
optimized for closed-loop gains greater than or equal to
2V/V (A
VCL
≥
2V/V). While consuming only 5mA (6mA
max) supply current, both devices can drive 50
back-
terminated cables to ±3.1V minimum.
The MAX4100 features a bandwidth in excess of 500MHz
and a 0.1dB gain flatness of 65MHz. It offers differential
gain and phase errors of 0.06%/0.04°, respectively. The
MAX4101 features a -3dB bandwidth of 200MHz, a 0.1dB
bandwidth of 50MHz, and 0.07%/0.04° differential gain
and phase.
Available in small 8-pin SO and μMAX packages, these
ICs are ideally suited for use in portable systems (in
RGB, broadcast, or consumer video applications) that
benefit from low power consumption.
__________Applic ations Information
Layout and Power-S upply Bypassing
The MAX4100/MAX4101 have an RF bandwidth and,
consequently, require careful board layout. Depending
on the size of the PC board used and the frequency of
operation, it may be desirable to use constant-imped-
ance microstrip or stripline techniques.
To realize the full AC performance of this high-speed
amplifier, pay careful attention to power-supply bypass-
ing and board layout. The PC board should have at
least two layers: a signal and power layer on one side,
and a large, low-impedance ground plane on the other
side. The ground plane should be as free of voids as
possible. With multilayer boards, locate the ground
plane on a layer that incorporates no signal or power
traces.
Regardless of whether a constant-impedance board is
used, it is best to observe the following guidelines
when designing the board. Wire-wrap boards are much
too inductive, and breadboards are much too capaci-
tive; neither should be used. IC sockets increase para-
sitic capacitance and inductance, and should not be
used. In general, surface-mount components give bet-
ter high-frequency performance than through-hole
components. They have shorter leads and lower para-
sitic reactances. Keep lines as short and as straight as
possible. Do not make 90° turns; round all corners.
High-frequency bypassing techniques must be observed
to maintain the amplifier accuracy. The bypass capaci-
tors should include a 1000pF ceramic capacitor between
each supply pin and the ground plane, located as close
to the package as possible. Next, place a 0.01μF to
0.1μF ceramic capacitor in parallel with each 1000pF
capacitor, and as close to each as possible. Then place
a 10μF to 15μF low-ESR tantalum at the point of entry (to
the PC board) of the power-supply pins. The power-sup-
ply trace should lead directly from the tantalum capacitor
to the V
CC
and V
EE
pins. To minimize parasitic induc-
tance, keep PC traces short and use surface-mount
components.
500MHz, Low-Power Op Amps
8
_______________________________________________________________________________________
MAX4101
V
OUT
= (R
F
/ R
G
)V
IN
V
IN
V
OUT
R
F
R
G
MAX4100
MAX4101
V
OUT
= [1 + (R
F
/ R
G
)]V
IN
V
IN
V
OUT
R
F
R
G
MAX4100
Figure 1b. Noninverting Gain Configuration
MAX4101
V
OUT
= V
IN
V
IN
V
OUT
24
MAX4100
Figure 1c. MAX4100 Unity-Gain Buffer Configuration
Figure 1a. Inverting Gain Configuration