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參數(shù)資料
| 型號(hào)： | MAX3905 |
| 廠商： | Maxim Integrated Products, Inc. |
| 英文描述： | 150Mbps Automotive VCSEL Driver |
| 中文描述： | 150Mbps汽車VCSEL驅(qū)動(dòng)器 |
| 文件頁數(shù)： | 9/13頁 |
| 文件大小： | 1168K |
| 代理商： | MAX3905 |
programmed by the LOW1 and LOW2 inputs. Connect
LOW1 or LOW2 to ground to set the bit high, and leave
open to set the bit low. Do not connect LOW1 or LOW2
to V
CC
.
The typical low current at T
J
= DT
0
can be calculated by:
I
LOW
≈
[1.8 + (0.37 x LOW1) + (0.73 x LOW2)]mA
where, LOW[1, 2] = 1 when bonded to ground; LOW[1, 2]
= 0 when left open.
The temperature coefficient of the bias current is pro-
grammed by the TC1, TC2, and TC3 inputs. Connect
TC1, TC2, or TC3 to ground to set the bit high, and
leave open to set the bit low. Do not connect TC1, TC2,
or TC3 to V
CC
.
The typical temperature coefficient of the bias current
can be calculated by:
TC
LOW
≈
[16 + (5 x TC1) + (11 x TC2) +
(16 x TC3)]μA/°C
where, TC[1, 2, 3] = 1 when bonded to ground; TC[1, 2,
3] = 0 when left open.
Junction-Temperature Sensing
A temperature sensor is incorporated into the MAX3905
to aid in evaluation of thermal performance. The
TEMPSENS voltage is proportional to the die junction
temperature (approximately -1.39mV per °C). The tem-
perature of the die can be estimated as:
Output Driver
The OUT pad connects directly to the VCSEL cathode.
The
OUT
pad must be connected to the VCSEL anode
or to V
CC
. The minimum instantaneous voltage on the
OUT pad is 0.9V.
Applications Information
Additional Design Assistance
For more information and design assistance, refer to
Maxim Design Note HFDN-32.0:
Output Current
Calculator for the MAX3905
.
Layout Considerations
Load inductance on OUT and
OUT
should be matched
within 1.5nH to minimize both jitter and supply noise
generation.
Wire Bonding
For high-current density and reliable operation, the
MAX3905 uses gold metalization. For best results, use
gold-wire ball-bonding techniques. Exercise caution
when wedge bonding. Die size is 1.52mm x 1.52mm
(60 mils x 60 mils), and die thickness is 300μm
(12 mils). The bond-pad passivation opening is 93μm x
93μm and bond-pad metal thickness is 1.2μm. Refer to
Maxim Application Note HFAN-08.0.1:
Understanding
Bonding Coordinates and Physical Die Size
for addi-
tional information on bondpad coordinates. Do not
attempt to bond to the laser trim target.
Laser Safety and IEC 825
Using the MAX3905 VCSEL driver alone does not
ensure that a transmitter design is compliant with
IEC 825. The entire transmitter circuit and component
selections must be considered. Determine the level of
fault tolerance required by each application, and rec-
ognize that Maxim products are not designed or autho-
rized for use as components in systems intended for
surgical implant into the body, for applications intended
to support or sustain life, or for any other application
where the failure of a Maxim product could create a sit-
uation where personal injury or death may occur.
T C
(
C V
°
mV x
(
C
mV
1
TEMPSENS
)
)
.
≈
°
597
0 72
-
M
150Mbps Automotive VCSEL Driver
_______________________________________________________________________________________
9
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