參數(shù)資料
型號: MAX3867
廠商: Maxim Integrated Products, Inc.
英文描述: +3.3V, 2.5Gbps SDH/SONET Laser Driver with Automatic Power Control
中文描述: +3.3V、2.5Gbps、 SDH/SONET激光驅動器,帶有自動功率控制
文件頁數(shù): 11/12頁
文件大小: 193K
代理商: MAX3867
Modulation Current More than 60mA
At +5V power supply, the headroom voltage for the
MAX3867 is significantly improved. In this case, it is
possible to achieve a modulation current of more than
60mA with AC-coupling, if the junction temperature is
kept below 150°C. The MAX3867 can also be DC-cou-
pled to a laser diode when operating at +5V supply; the
voltage at OUT+ should be
2.0V for proper operation.
Wire Bonding Die
For high current density and reliable operation, the
MAX3867 uses gold metalization. Make connections to
the die with gold wire only, using ball-bonding tech-
niques. Wedge bonding is not recommended. Die-pad
size is 4 mils (100μm) square, and die thickness is 12
mils (300μm) mils.
Layout Considerations
To minimize inductance, keep the connections between
the MAX3867 output pins and LD as close as possible.
Optimize the laser diode performance by placing a
bypass capacitor as close as possible to the laser
anode. Use good high-frequency layout techniques
and multilayer boards with uninterrupted ground planes
to minimize EMI and crosstalk.
Laser S afety and IEC 825
Using the MAX3867 laser driver alone does not ensure
that a transmitter design is compliant with IEC 825. The
entire transmitter circuit and component selections must
be considered. Each customer must determine the level
of fault tolerance required by their application, recogniz-
ing that Maxim products are not designed or authorized
for use as components in systems intended for surgical
implant into the body, for applications intended to sup-
port or sustain life, or for any other application where the
failure of a Maxim product could create a situation
where personal injury or death may occur.
M
+3.3V, 2.5Gbps S DH/S ONET Laser Driver
with Automatic Power Control
______________________________________________________________________________________
11
Pin Configuration
Chip Topography
42
43
44
45
46
38
39
40
41
47
16
19
21
20
22 23
17 18
14 15
2
3
4
5
6
7
8
9
10
11
26
27
28
29
30
31
32
33
34
35
VCC1
G
B
MAX3867
TQFP
TOP VIEW
M
G
A
N
G
N
G
N
C
37
V
E
S
G
F
V
N
G
G
A
24
V
MD
GND3
GND4
VCC4
N.C.
OUT-
OUT+
N.C.
VCC4
N.C.
25
BIAS
12
GND1
CLK-
CLK+
VCC1
GND1
VCC1
DATA-
DATA+
VCC1
GND1
1
36
GND3
GND2
48
13
V
L
LATCH
ENABLE
GND1
GND1
SLWSTRT
VCC1
GND1
VCC1
CLK+ GND1 DATA- VCC1
CLK-
VCC1 VCC1 DATA+ GND1
FAIL
GND4
N.C.
APCFILT
GND4
VCC4
MD
GND4
N.C.
OUT+
VCC4
OUT-
N.C.
N.C.
GND3
VCCA
BIAS
VCC2
BIASMAX
MODSET
GND2
APCSET
N.C.
GND2
GND2
N.C.
GND3
N.C.
CAPC
VCC3
GND3
0.083"
(2.108mm)
0.070"
(1.778mm)
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