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參數(shù)資料
| 型號： | MAX3793 |
| 廠商： | Maxim Integrated Products, Inc. |
| 元件分類： | 運動控制電子 |
| 英文描述： | 1Gbps to 4.25Gbps Multirate Transimpedance Amplifier with Photocurrent Monitor |
| 中文描述： | 1Gbps至4.25Gbps多速率互阻放大器，具有光電流監(jiān)測器 |
| 文件頁數(shù)： | 8/11頁 |
| 文件大小： | 693K |
| 代理商： | MAX3793 |
M
If the amount of tolerable noise is known, the filter
capacitor can be easily selected:
C
FILT
= (V
NOISE
x C
IN
) / (R
FILT
x I
NOISE
)
For example, with maximum noise voltage = 100mV
P-P
,
C
IN
= 0.6pF, R
FILT
= 750
, and I
NOISE
at 350nA, the
filter capacitor is:
C
FILT
= (100mV x 0.6pF) / (750
x 350nA) = 229pF
Select R
MON
If photocurrent monitoring is desired, connect a resistor
between MON and ground to monitor the average pho-
tocurrent. Select the largest R
MON
possible:
where, I
MONMAX
is the largest average input current
observed. An ammeter can also be used to monitor the
current out of the MON pin.
Layout Considerations
Figure 3 shows suggested layouts for 4-pin and 5-pin
TO headers.
Wire Bonding
For high-current density and reliable operation, the
MAX3793 uses gold metalization. For best results, use
gold-wire ball-bonding techniques. Exercise caution if
attempting wedge bonding. The die size is 30 mils x 50
mils (0.762mm x 1.27mm), and the die thickness is 15
mils (380μm). Bond-pad size for the V
CC
, GND, OUT+,
and OUT- pads is 94μm x 94μm. Bond-pad size for the
FILT, IN, and MON pads is 79μm x 79μm; all bond-pad
metal thickness is 1.2μm. Refer to Maxim Application
Note HFAN-08.0.1:
Understanding Bonding Coordinates
and Physical Die Size
for additional information on bond-
pad coordinates. Recommended bonding sequence is
shown in Figure 4.
R
V
I
MON
MONMAX
.
=
2 0
1Gbps to 4.25Gbps Multirate Transimpedance
Amplifier with Photocurrent Monitor
8
_______________________________________________________________________________________
OUT-
OUT+
V
CC
PHOTODIODE
F
I
M
C
VCC
MON
5-PIN HEADER
4-PIN HEADER
PHOTODIODE IS MOUNTED
ON C
FILT
,
CASE IS GROUND.
C
FILT
MAX3793
OUT-
OUT+
V
CC
PHOTODIODE
F
I
M
C
VCC
PHOTODIODE IS MOUNTED
ON C
FILT
,
CASE IS GROUND.
C
FILT
MAX3793
Figure 3. Suggested TO Header Layouts
MAX3793
C
VCC
C
FILT
11
1
10
2
5
6
8
4
7
3
9
Figure 4. Recommended MAX3793 Bonding Scheme
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX3793E/D | 功能描述:多路器開關(guān) IC RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 開關(guān)數(shù)量:4 開啟電阻（最大值）:7 Ohms 開啟時間（最大值）: 關(guān)閉時間（最大值）: 傳播延遲時間:0.25 ns 工作電源電壓:2.3 V to 3.6 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UQFN-16 |
| MAX3793EVKIT | 功能描述:交換機 IC 開發(fā)工具 RoHS:否 制造商:Maxim Integrated 產(chǎn)品:Evaluation Kits 類型:USB Power Switches 工具用于評估:MAX4984E 工作電源電壓:2.8 V to 5.5 V |
| MAX3795ETG | 功能描述:激光驅(qū)動器 1-4.25Gbps VCSEL Driver RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
| MAX3795ETG+ | 功能描述:激光驅(qū)動器 1-4.25Gbps VCSEL Driver RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
| MAX3795ETG+T | 功能描述:激光驅(qū)動器 1-4.25Gbps VCSEL Driver RoHS:否 制造商:Micrel 數(shù)據(jù)速率:4.25 Gbps 工作電源電壓:3 V to 3.6 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:QFN-16 封裝:Tube |
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