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參數(shù)資料
| 型號(hào)： | MAX3741 |
| 廠商： | Maxim Integrated Products, Inc. |
| 英文描述： | Full-Duplex LVDM Transceiver 8-SOIC -40 to 85 |
| 文件頁(yè)數(shù)： | 7/10頁(yè) |
| 文件大?。?/td> | 531K |
| 代理商： | MAX3741 |
Designing the Compensation
Filter Network
VCSEL package inductance causes the VCSEL imped-
ance to increase at high frequencies, leading to ring-
ing, overshoot, and degradation of the VCSEL output. A
VCSEL compensation filter network can be used to
reduce the VCSEL impedance at high frequencies,
thereby reducing output ringing and overshoot.
The compensation components (R
F
and C
F
) are most
easily determined by experimentation. Begin with R
F
=
50
and C
F
= 1pF. Increase C
F
until the desired trans-
mitter response is obtained (Figure 5). Refer to
Application Note HFAN-2.0:
Interfacing Maxim Laser
Drivers with Laser Diodes
for more information.
Exposed-Pad (EP) Package
The exposed pad on the 16-pin thin QFN provides a
very low thermal resistance path for heat removal from
the IC. The pad is electrical ground on the MAX3741
and must be soldered to the circuit board ground for
proper thermal and electrical performance. Refer to
Maxim Application Note HFAN-08.1:
Thermal
Considerations for QFN and Other Exposed Pad
Packages
, for additional information.
M
3.2Gbps Compact SFP VCSEL Driver
_______________________________________________________________________________________
7
V
CC
IN+
IN-
OUT-
OUT+
PEAKSET
CURRENT AMPLIFIER
34x
ENABLE
100
R
OUT
MODULATION
CURRENT
GENERATION
PEAKING
CONTROL
CURRENT
SWITCH
R
MODSET
INPUT
BUFFER
MODSET
MAX3741
R
PEAKSET
1.0V
R
OUT
Figure 2. Modulation Circuit
MAX3741
IN+
IN-
1nH
1nH
0.5pF
0.5pF
V
CC
50
50
16k
24k
V
CC
V
CC
PACKAGE
Figure 4. Simplified Input Structure
V
CC
MAX3741
PACKAGE
1nH
1nH
0.5pF
0.5pF
OUT-
OUT+
R
OUT
R
OUT
Figure 3. Simplified Output Structure
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| MAX3741ETE | Full-Duplex LVDM Transceiver 14-SOIC -40 to 85 |
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| MAX3746ETE | Dual Multiplexed LVDM Repeater 16-SOIC -40 to 85 |
| MAX3747 | Dual Multiplexed LVDM Repeater 16-SOIC -40 to 85 |
| MAX3747-MAX3747A | Dual Multiplexed LVDM Repeater 16-SOIC -40 to 85 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX3741ETE | 功能描述:通信集成電路 - 若干 RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube |
| MAX3741ETE-T | 功能描述:通信集成電路 - 若干 RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube |
| MAX3741EVKIT | 功能描述:通信集成電路 - 若干 RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube |
| MAX3741HETE | 制造商:Maxim Integrated Products 功能描述:3.2GBPS COMPACT SFP VCSEL DRIVER - Rail/Tube |
| MAX3741HETE#G16 | 功能描述:通信集成電路 - 若干 RoHS:否 制造商:Maxim Integrated 類型:Transport Devices 封裝 / 箱體:TECSBGA-256 數(shù)據(jù)速率:100 Mbps 電源電壓-最大:1.89 V, 3.465 V 電源電壓-最小:1.71 V, 3.135 V 電源電流:50 mA, 225 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝:Tube |
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