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參數(shù)資料
| 型號(hào)： | MAX3532* |
| 廠商： | Maxim Integrated Products, Inc. |
| 英文描述： | Low-Voltage Silicon RF Power-Amplifier Predriver[MAX2430/MAX2430EVKIT-SO/MAX2430ISE/MAX2430ISE-T ] |
| 中文描述： | 低電壓硅射頻功率放大器預(yù)驅(qū)動(dòng)器[MAX2430/MAX2430EVKIT-SO/MAX2430ISE/MAX2430ISE-T] |
| 文件頁(yè)數(shù)： | 10/13頁(yè) |
| 文件大?。?/td> | 398K |
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M
Upstream CATV Amplifier
10
______________________________________________________________________________________
(IN+ or IN-). The value of this capacitor must be large
enough to look like a short circuit at the lowest frequen-
cy of interest. For operation at 5MHz with a 75
source
impedance, a value of 0.001μF suffices.
Layout Issues
A well-designed PC board is an essential part of an RF
circuit. For best performance, pay attention to power-sup-
ply layout issues as well as to the output circuit layout.
Output Circuit Layout
The differential implementation of the MAX3503
’
s out-
put has the benefit of significantly reducing even-order
distortion, the most significant of which is 2nd harmonic
distortion. The degree of distortion cancellation
depends on the amplitude and phase balance of the
overall circuit. Keep the trace lengths from the output
pins equal.
Power-Supply Layout
For minimal coupling between different sections of the
IC, the ideal power-supply layout is a star configuration.
This configuration has a large-value decoupling capac-
itor at the central power-supply node. The power-
supply traces branch out from this node, each going to
a separate power-supply node in the circuit. At the end
of each of these traces is a decoupling capacitor that
provides very low impedance at the frequency of inter-
est. This arrangement provides local power-supply
decoupling at each power-supply pin.
The power-supply traces must be made as thick as is
practical. Ground inductance degrades distortion per-
formance. Therefore, make ground plane connections
with multiple vias.
Exposed-Paddle Thermal Considerations
The MAX3503
’
s 20-pin QFN package provides a low
thermal-resistance path to the die. The PC board on
which the MAX3503 is mounted must be designed to
conduct heat from this contact. In addition, the EP
should be provided with a low-inductance path to elec-
trical ground. Maxim recommends that the EP be sol-
dered to a ground plane on the PC board, either
directly or through an array of plated via holes.
Chip Information
TRANSISTOR COUNT: 1180
SUBSTRATE CONNECTED TO GND
SHDN
TXEN
D7
D6
D5
D4
D3
D2
D1
D0
GAIN CODE
(DECIMAL)
43
92
112
83
99
119
STATES
0
1
1
1
1
1
1
1
1
1
X
0
1
1
1
1
1
1
1
1
X
X
1
0
0
0
0
1
1
1
X
X
X
X
0
1
1
1
1
1
X
X
X
X
1
0
1
0
1
1
X
X
X
X
1
1
0
1
0
1
X
X
X
X
0
0
1
0
1
0
X
X
X
X
0
0
1
1
1
1
X
X
X
X
0
0
1
1
1
1
X
X
X
X
0
0
0
0
1
1
Shutdown mode
Transmit-disable mode
Transmit-enable mode, high power
Transmit-enable mode, low noise
A
V
= -26.0dB*
A
V
= -0.5dB*
A
V
= -95dB*
A
V
= -10.5dB*
A
V
= -18.5dB*
A
V
= -28.5dB*
Table 2. Chip-State Control Bits
*
Typical gain at +25
°
C, V
CC
= 3.3V.
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