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MAX3450E/MAX3451E/MAX3452E
±15kV ESD-Protected USB Transceivers
2
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ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(VBUS = +4.0V to +5.5V or VTRM = +3.0V to +3.6V, VL = +1.65V to +3.6V, TA = TMIN to TMAX, unless otherwise noted. Typical values
are at VBUS = +5.0V, VL = +2.5V, and TA = +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SUPPLY INPUTS (VBUS, VTRM, VL)
Regulated Supply Voltage
Output
VTRM
Internal regulator
3.0
3.3
3.6
V
Operating Supply Current
IVBUS
Full-speed transmitting/receiving at 12Mbps,
CL = 50pF on D+ and D- (Note 3)
10
mA
Operating VL Supply Current
IVL
Full-speed transmitting/receiving at 12Mbps
(Note 3)
2.5
mA
Full-speed idle: VD+ > 2.7V, VD- < 0.3V
250
350
Full-Speed Idle and SE0 Supply
Current
IVBUS(IDLE)
SE0: VD+ < 0.3V, VD- < 0.3V
250
350
A
MAX3450E,
MAX3451E
5
Static VL Supply Current
IVL(STATIC)
Full-speed idle,
SE0, or suspend
mode
MAX3452E
15
A
MAX3450E,
MAX3451E
(ENUM = low)
35
Suspend Supply Current
IVBUS(SUSP)
VM = VP = open,
SUS =
OE = high
MAX3452E
40
A
Disable-Mode Supply Current
IVBUS(DIS)
VL = GND or open
20
A
MAX3450E,
MAX3451E
5
Sharing-Mode VL Supply
Current
IVL(SHARING)
VBUS = GND or open,
OE = low, VP = low or
high, VM = low or
high, SUS = high
MAX3452E
20
A
D+/D- Sharing-Mode
Load Current
ID_(SHARING) VBUS = GND or open, VD_ = 0 or +5.5V
20
A
D+/D- Disable-Mode
Load Current
ID_(DIS)
VL = GND or open, VD_ = 0 or +5.5V
5
A
VBUS, VL, D+, D- to GND.......................................-0.3V to +6.0V
VTRM to GND ............................................-0.3V to (VBUS + 0.3V)
VP, VM, SUS, SPD, ENUM,
RCV,
OE, BD to GND ................................-0.3V to (VL + 0.3V)
Current (into any pin)........................................................±15mA
Short-Circuit Current (D+ and D-) ..................................±150mA
Continuous Power Dissipation (TA = +70°C)
14-Pin TSSOP
(derate 10mW/°C above +70°C) ..................................797mW
16-Pin Thin QFN-EP 3mm x 3mm
(derate 20.8mW/°C above +70°C) .............................1667mW
Package Junction-to-Ambient Thermal Resistance (
θJA) (Note 1)
14-Pin TSSOP..........................................................100.4°C/W
16-Pin Thin QFN-EP .....................................................48°C/W
Package Junction-to-Case Thermal Resistance (
θJC) (Note 1)
14-Pin TSSOP...............................................................30°C/W
16-Pin Thin QFN-EP .......................................................7°C/W
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: Package thermal resistances were obtained using the method described in JEDEC specifications. For detailed information
on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.