In tri-state output mo" />
參數(shù)資料
型號(hào): MAX3394EEBL+T
廠商: Maxim Integrated Products
文件頁(yè)數(shù): 3/20頁(yè)
文件大?。?/td> 0K
描述: IC LVL XLTR LV 6MBPS PP 9UCSP
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 1
邏輯功能: 變換器,雙向,3 態(tài)
位數(shù): 2
輸入類型: 邏輯
輸出類型: 邏輯
數(shù)據(jù)速率: 6Mbps
通道數(shù): 2
輸出/通道數(shù)目: 1
差分 - 輸入:輸出: 無(wú)/無(wú)
傳輸延遲(最大): 50ns
電源電壓: 1.65 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
封裝/外殼: 8-UFBGA,WLCSP
供應(yīng)商設(shè)備封裝: 9-UCSP(3x3)
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: MAX3394EEBL+TDKR
The high-impedance state of the I/O lines during tri-
state output mode facilitates use in multidrop networks.
In tri-state output mode, do not exceed (VL + 0.3V) on
I/O VL_ or (VCC + 0.3V) on I/O VCC_.
Thermal-Shutdown Protection
The MAX3394E/MAX3395E/MAX3396E are protected
from thermal damage resulting from short-circuit faults.
In the event of a short-circuit fault, when the junction
temperature (TJ) reaches +125°C, a thermal sensor
forces the device into the tri-state output mode. When
TJ drops below +115°C, normal operation resumes.
±15kV ESD Protection
As with all Maxim devices, ESD-protection structures are
incorporated on all pins to protect against ESD encoun-
tered during handling and assembly. The I/O VCC_ lines
are further protected by advanced ESD structures to
guard these pins from damage caused by ESD of up to
±15kV. Protection structures prevent damage caused by
ESD events in normal operation, tri-state output mode,
and when the device is unpowered. After arresting an
ESD event, MAX3394E/MAX3395E/MAX3396E continue
to function without latching up, whereas competing
devices can enter a latched-up state and must be power
cycled to restore functionality.
Several ESD testing standards exist for gauging the
robustness of ESD structures. The ESD protection of
the MAX3394E/MAX3395E/MAX3396E is characterized
for the human body model (HBM). Figure 6a shows the
model used to simulate an ESD event resulting from
contact with the human body. The model consists of a
100pF storage capacitor that is charged to a high volt-
age then discharged through a 1.5k
Ω resistor. Figure
6b shows the current waveform when the storage
capacitor is discharged into a low impedance.
To ensure full ±15kV ESD protection, bypass VCC to
ground with a 0.1F ceramic capacitor and an additional
1F ceramic capacitor as close to the device as possible.
ESD Test Conditions
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report documenting test
setup, methodology, and results.
Applications Information
Power-Supply Decoupling
Bypass VL and VCC to ground with 0.1F ceramic
capacitors. To ensure full ±15kV ESD protection,
bypass VCC to ground with an additional 1F or greater
ceramic capacitor. Place all capacitors as close to the
device as possible.
Open-Drain Mode vs. Push-Pull Mode
The MAX3394E/MAX3395E/MAX3396E are compatible
with push-pull (active) and open-drain drivers. For push-
pull operation, maximum data rate is guaranteed to
6Mbps. For open-drain applications, the MAX3394E/
MAX3395E/MAX3396E include internal pullup resistors
and slew-rate enhancement circuitry, providing a maxi-
mum data rate of 1Mbps. External pullup resistors can
be added to increase data rate when the bus is loaded
by high capacitance. (See the
Use of External Pullup
Resistors section.)
Serial-Interface Level Translation
The MAX3395E provides level translation on four I/O
lines, making it an ideal device for multivoltage I2C,
MICROWIRE, and SPI serial interfaces.
Use of External Pullup Resistors
The MAX3394E/MAX3395E/MAX3396E include internal
10k
Ω pullup resistors. During a low-to-high logic transi-
tion, the internal pullup resistors charge the bus capac-
MAX3394E/MAX3395E/MAX3396E
±15kV ESD-Protected, High-Drive Current, Dual-/Quad-/
Octal-Level Translators with Speed-Up Circuitry
______________________________________________________________________________________
11
CHARGE-CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
100pF
RC
1M
Ω
RD
1500
Ω
HIGH-
VOLTAGE
DC
SOURCE
DEVICE-
UNDER-
TEST
Figure 6a. Human Body ESD Test Model
IP 100%
90%
36.8%
tRL
TIME
tDL
CURRENT WAVEFORM
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
Ir
10%
0
AMPERES
Figure 6b. HBM Discharge Current Waveform
相關(guān)PDF資料
PDF描述
MAX3373EEKA+T IC LVL XLTR LV 8MBPS SOT23-8
MAX3370EXK+T IC LEV XLTR LV 2MBPS 1UA SC70-5
VI-J0F-MZ-F2 CONVERTER MOD DC/DC 72V 25W
PI6C2405A-1HLE IC 1:5 0-DELAY CLOCK BUFF 8TSSOP
VE-JVT-MZ-F3 CONVERTER MOD DC/DC 6.5V 25W
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MAX3394EETA 制造商:Maxim Integrated Products 功能描述:+/-15KV ESD-PROTECT HI DRIVE CURR - Rail/Tube
MAX3394EETA+ 制造商:Maxim Integrated Products 功能描述:LEVEL TRANSLATOR 8TDFN EP - Rail/Tube
MAX3394EETA+T 功能描述:轉(zhuǎn)換 - 電壓電平 High-Drive Current RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8
MAX3394EETA-T 功能描述:轉(zhuǎn)換 - 電壓電平 RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8
MAX3395EEBC+ 制造商:Maxim Integrated Products 功能描述:LEVEL TRANSLATOR 12UCSP - Rail/Tube