
M
+3.3V, 2.5Gbps Low-Power
Limiting Amplifiers
2
_______________________________________________________________________________________
ELECTRICAL CHARACTERISTICS
(V
CC
= +3.0V to +3.6V, T
A
= -40°C to +85°C. Typical values are at V
CC
= +3.3V and T
A
= +25°C, unless otherwise noted.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Power-Supply Voltage (V
CC
).................................-0.5V to +6.0V
Voltage at IN+, IN- ..........................(V
CC
- 2.4V) to (V
CC
+ 0.5V)
Voltage at SQUELCH, CAZ1, CAZ2,
TH, CLOS ...............................................-0.5V to (V
CC
+ 0.5V)
Voltage at LOS,
LOS
(MAX3272)...........................-0.5V to +6.0V
Voltage at LOS,
LOS
(MAX3272A).............-0.5V to (V
CC
+ 0.5V)
Voltage at LEVEL...................................................-0.5V to +2.0V
Voltage at OUTPOL...............................................-0.5V to +6.0V
Current into LOS,
LOS
..........................................-1mA to +9mA
Differential Input Voltage (IN+ - IN-).................................2.5V
P-P
Continuous Current at IN+, IN-...........................................50mA
Continuous Current at
CML Outputs (OUT+, OUT-).........................-25mA to +25mA
Continuous Power Dissipation at +85°C
20-Pin Thin QFN (derate 16.9mW/°C above +85°C) ......1.1W
20-Pin QFN (derate 20mW/°C above +85°C) .................1.3W
Storage Ambient Temperature
Range (T
STG
).................................................-55°C to +150°C
Operating Junction Temperature
Range (T
J
) .....................................................-55°C to +150°C
Die Attach Temperature...................................................+400°C
Lead Temperature (soldering, 10s).................................+300°C
PARAMETER
SYMBOL
I
CC
CONDITIONS
MIN
TYP
33
2.5
MAX
44
UNITS
mA
Gbps
mV
P-P
ps
P-P
ps
RMS
Supply Current
Input Data Rate
Input Voltage Range
Output Deterministic Jitter
Random Jitter
(Note 2)
V
IN
Differential
(Notes 3, 4, 5)
(Notes 4, 6)
15
1200
27
5
3
90
90
100
220
750
2.2
30
0.9
1.5
50
10
9
10
15mV
P-P
< V
IN
≤
30mV
P-P
30mV
P-P
≤
V
IN
≤
1200mV
P-P
130
115
105
Data Output Edge Speed
(20% to 80%)
(Notes 3, 4)
ps
Differential Input Resistance
Input-Referred Noise
CML Output Voltage
Output Signal when Squelched
Power-Supply Noise Rejection
R
IN
IN+ to IN-
95
μV
RMS
mV
P-P
mV
P-P
dB
MHz
kHz
V
OUT
LEVEL open, R
LOAD
= 50
Outputs AC-coupled
f
≤
2MHz (Note 7)
C
AZ
= open
C
AZ
= 0.1μF
Single ended to V
CC
≤
2.5GHz
2.5GHz to 4.0GHz
4.0GHz
550
1200
PSNR
Low Frequency Cutoff
f
OC
Output Resistance
R
OUT
42.5
57.5
Single-Ended Output Return
Loss
dB
Differential Input Return Loss
dB
V
IL
V
IH
0.8
OUTPOL Input Limits
2.4
2
V
LOS Hysteresis
(Notes 3, 4, 8)
C
CLOS
= open (Notes 3, 9, 10)
C
CLOS
= 0.01μF (Notes 3, 9, 10)
R
TH
= 20k
(Notes 3, 10)
R
TH
= 20k
(Notes 3, 10)
R
TH
= 1k
(Notes 3, 10)
R
TH
= 1k
(Notes 3, 10)
R
TH
= 80
(Notes 3, 10)
3.3
1
50
6.5
9.5
12.9
17.4
48
dB
LOS Assert/Deassert Time
2.3
4.5
100
μs
Low LOS Assert Level
Low LOS Deassert Level
Medium LOS Assert Level
Medium LOS Deassert Level
High LOS Assert Level
mV
P-P
mV
P-P
mV
P-P
mV
P-P
mV
P-P
12.7
7.8
22.4
24.3
ABSOLUTE MAXIMUM RATINGS