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參數(shù)資料
| 型號： | MAX3229EEBV |
| 廠商： | MAXIM INTEGRATED PRODUCTS INC |
| 元件分類： | 通用總線功能 |
| 英文描述： | 【15kV ESD-Protected @.5V to %.5V RS-232 Transceivers in UCSP |
| 中文描述： | LINE TRANSCEIVER, PBGA30 |
| 封裝： | UCSP-30 |
| 文件頁數(shù)： | 11/14頁 |
| 文件大?。?/td> | 238K |
| 代理商： | MAX3229EEBV |
UCSP Reliability
The UCSP represents a unique packaging form factor
that may not perform equally to a packaged product
through traditional mechanical reliability tests. CSP relia-
bility is integrally linked to the user
’
s assembly methods,
circuit board material, and usage environment. The user
should closely review these areas when considering use
of a CSP package. Performance through Operating Life
Test and Moisture Resistance remains uncompromised
as it is primarily determined by the wafer-fabrication
process.
Mechanical stress performance is a greater considera-
tion for a CSP package. CSPs are attached through
direct solder contact to the user
’
s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be consid-
ered. Table 5 shows the testing done to characterize
the CSP reliability performance. In conclusion, the
UCSP is capable of performing reliably through envi-
ronmental stresses as indicated by the results in the
table. Additional usage data and recommendations are
detailed in the UCSP application note, which can be
found on Maxim
’
s website at www.maxim-ic.com.
Chip Information
TRANSISTOR COUNT: 698
PROCESS TECHNOLOGY: CMOS
M
+2.5V to +5.5V RS-232 Transceivers
in UCSP
______________________________________________________________________________________
11
V
L
MAX3229
5k
R1IN
R1OUT
TTL/CMOS
C2-
T1IN
C2+
C1-
C1+
A1
A5
C1
D1
A2
A3
A6
C6
B1
A4
E3
E5
E2
20
μ
A
20
μ
A
E1
C5
B5
V-
V+
V
CC
2.5V TO 5.5V
C4
0.1
μ
F
C3
0.1
μ
F
C1
0.1
μ
F
C
BYPASS
C2
0.1
μ
F
0.1
μ
F
0.1
μ
F
FORCEOFF
FORCEON
INVALID
T1OUT
GND
V
L
TO POWER-
MANAGEMENT
UNIT
RS-232
V
L
V
L
V
L
1.65V TO 5.5V
V
L
Typical Operating Circuits
(continued)
TEST
CONDITIONS
DURATION
NO. OF FAILURES PER
SAMPLE SIZE
Temperature Cycle
-35
°
C to +85
°
C,
-40
°
C to +100
°
C
T
A
= +70
°
C
+20
°
C to +60
°
C, 90% RH
-20
°
C
150 cycles,
900 cycles
0/10,
0/200
Operating Life
Moisture Resistance
Low-Temperature Storage
240hr
240hr
240hr
0/10
0/10
0/10
Low-Temperature Operational
-10
°
C
24hr
0/10
Solderability
ESD
High-Temperature Operating
Life
8hr steam age
±
2000V, Human Body Model
—
—
0/15
0/5
T
J
= +150
°
C
168hr
0/45
Table 5. Reliability Test Data
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MAX3228-MAX3229 | +2.5V to +5.5V RS-232 Transceivers in UCSP |
| MAX3228EBV | +2.5V to +5.5V RS-232 Transceivers in UCSP |
| MAX3229 | +2.5V to +5.5V RS-232 Transceivers in UCSP |
| MAX322CSA | Precision, Dual-Supply, SPST Analog Switches |
| MAX320-MAX322 | Precision, Dual-Supply, SPST Analog Switches |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX3229EEBV-T | 制造商:Maxim Integrated Products 功能描述::15KV ESD, +2.5V TO +5.5V 1TX/1RX RS-232 TRA - Tape and Reel |
| MAX322C/D | 功能描述:模擬開關(guān) IC RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時間（最大值）: 關(guān)閉時間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| MAX322C/D DIE | 制造商:Maxim Integrated Products 功能描述: |
| MAX322CPA | 功能描述:模擬開關(guān) IC RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時間（最大值）: 關(guān)閉時間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| MAX322CPA+ | 功能描述:模擬開關(guān) IC Precision Dual Supply SPST RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時間（最大值）: 關(guān)閉時間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
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