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M
±15kV ESD-Protected +2.5V to +5.5V
RS-232 Transceivers in UCSP
IEC 1000-4-2
The IEC 1000-4-2 standard covers ESD testing and per-
formance of finished equipment; it does not specifically
refer to integrated circuits. The MAX3228E/MAX3229E
help you design equipment that meets Level 4 (the high-
est level) of IED 1000-4-2, without the need for addition-
al ESD-protection components.
The major difference between tests done using the
Human Body Model and IEC 1000-4-2 is a higher peak
current in IEC 1000-4-2, because series resistance is
lower in the IEC 1000-4-2 model. Hence, the ESD with-
stand voltage measured to IEC 1000-4-2 is generally
lower than that measured using the Human Body Model.
Figure 6a shows the IEC 1000-4-2 model, and Figure 6b
shows the current waveform for the ±8kV IEC 1000-4-2
Level 4 ESD contact discharge test.
The air-gap test involves approaching the device with a
charged probe. The Contact Discharge method con-
nects the probe to the device before the probe is ener-
gized.
Machine Model
The Machine Model for ESD tests all pins using a 200pF
storage capacitor and zero discharge resistance. Its
objective is to emulate the stress caused by contact that
occurs with handling and assembly during manufactur-
ing. Of course, all pins require this protection during
manufacturing, not just RS-232 inputs and outputs.
Therefore, after PC board assembly, the Machine Model
is less relevant to I/O ports.
Applications Information
Capacitor Selection
The capacitor type used for C1
–
C4 is not critical for
proper operation; either polarized or non polarized
capacitors may be used. However, ceramic chip
capacitors with an X7R or X5R dielectric work best. The
charge pump requires 0.1μF capacitors for 3.3V opera-
tion. For other supply voltages, refer to Table 4 for
required capacitor values. Do not use values smaller
than those listed in Table 4. Increasing the capacitor
values (e.g., by a factor of 2) reduces ripple on the
transmitter outputs and slightly reduces power con-
sumption. C2, C3, and C4 can be increased without
changing C1
’
s value.
However, do not increase C1
without also increasing the values of C2, C3, and C4
to maintain the proper ratios (C1 to the other capac-
itors).
When using the minimum required capacitor values,
make sure the capacitor value does not degrade
excessively with temperature. If in doubt, use capaci-
tors with a larger nominal value. The capacitor
’
s equiv-
alent series resistance (ESR) usually rises at low
temperatures and influences the amount of ripple on
V+ and V-.
Power-Supply Decoupling
In most circumstances, a 0.1μF V
CC
bypass capacitor
is adequate. In applications that are sensitive to power-
supply noise, use a capacitor of the same value as the
charge-pump capacitor C1. Connect bypass capaci-
tors as close to the IC as possible.
CHARGE-CURRENT
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
Cs
150pF
R
C
50M
to 100M
R
D
330
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
Figure 6a. IEC 1000-4-2 ESD Test Model
tr = 0.7ns to 1ns
30ns
60ns
t
100%
90%
10%
I
P
I
Figure 6b. IEC 1000-4-2 ESD Generator Current Waveform
V
CC
(V)
2.5 to 3.0
3.0 to 3.6
4.5 to 5.5
3.0 to 5.5
C1, C
BYPASS
(μF)
0.22
0.1
0.047
0.22
C2, C3, C4 (μF)
0.22
0.1
0.33
1
Table 4. Required Capacitor Values
10
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