參數(shù)資料
型號(hào): MAX3207E
廠商: Maxim Integrated Products, Inc.
英文描述: Dual LVDS Transmitter 8-SOIC -40 to 85
中文描述: 雙路、四路、六路高速差分ESD保護(hù)IC
文件頁(yè)數(shù): 3/13頁(yè)
文件大?。?/td> 303K
代理商: MAX3207E
M
Dual, Quad, and Hex High-Speed
Differential ESD-Protection ICs
_______________________________________________________________________________________
3
CLAMP VOLTAGE
vs. DC CURRENT
M
DC CURRENT (mA)
C
130
110
90
70
50
30
0.5
0.7
0.9
1.1
1.3
1.5
0.3
10
150
I/O_ TO V
CC
GND TO I/O_
LEAKAGE CURRENT
vs. TEMPERATURE
M
TEMPERATURE (
°
C)
L
80
40
0
10
100
1000
10,000
1
-40
120
INPUT CAPACITANCE
vs. INPUT VOLTAGE
M
INPUT VOLTAGE (V)
I
4
3
2
1
1
2
3
4
0
0
5
Typical Operating Characteristics
(V
CC
= +5V, T
A
= +25°C, unless otherwise noted.)
Pin Description
PIN
MAX3205E
TQFN
MAX3207E
SOT23
MAX3208E
μMAX
UCSP
TQFN
NAME
FUNCTION
4, 5, 7,
12, 13, 15
A2, A3, B1,
B3, C1, C2
1, 4
1, 4, 6, 9
4, 7, 12, 15
I/O_
ESD-Protected Channel
1, 3, 6, 8, 9,
11, 14, 16
3, 6
2, 5, 7, 10
1, 3, 5, 6,
8, 9, 11,
13, 14, 16
N.C.
No Connection. Not internally connected.
B2
N.C.
No Connection. The solder sphere is omitted from this
location (see the
Packaging Information
section).
2
A1
2
3
2
GND
Ground. Connect GND with a low-impedance
connection to the ground plane.
10
C3
5
8
10
V
CC
Power-Supply Input. Bypass V
CC
to GND with a 0.1μF
ceramic capacitor as close to the device as possible.
EP
EP
EP
Exposed Pad. Connect EP to GND.
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